This study explored the impact of micropattern designs on slurry dynamics in chemical mechanical planarization (CMP), focusing on pressure distribution, slurry flow and streamlines, abrasive residence time, and drag force. Using computational fluid dynamics (CFD) simulations, we examined how different pad patterns, including circle, triangle, square, ellipse, and square-circle, affect slurry behavior. It was found that the elliptical patterns caused the largest pressure drops due to their shape and arrangement, thus affecting material removal rates. Velocity analyses revealed that mean residence times and slurry flow velocities vary for different patterns, impacting the effectiveness of material removal. The results for the square-circle pattern showed a balanced slurry interaction, optimizing MRR by ensuring uniform slurry distribution and minimizing recirculation. The simulated drag forces exerted by the slurry on the pad patterns were correlated with the oxide removal rates. Particle tracking further illustrated how pattern design affects abrasive particle distribution, which is crucial for uniform polishing. The study identified the square-circle pattern as the optimal pattern design for TEOS film removal, highlighting the importance of pad pattern geometry in enhancing CMP efficiency. The presented simulation study highlighted the significance of micropattern design in advancing semiconductor manufacturing, offering insights for future pad design innovations.

We investigated the impact of the designed contact area (DCA) and designed contact length (DCL) on material removal rates (MRR) when using a pad with a structured surface in chemical mechanical polishing. The structure of the structured surface pad (SSP) was precisely defined, and an examination was conducted to assess the influence of variations in the shape, size, and spacing of the unit figure (UF) on the MRR. The results revealed that maintaining the DCA constant while altering the UF shape to extend the DCL led to a 203% increase in the MRR. Furthermore, modifications in the UF size enhanced the MRR by approximately 630%. The relationship between the DCL and MRR was dependent on the DCA. The characteristics of the SSP, particularly the concentrated pressure and involvement of slurry particles at the edges of the contact area, indicated that an increase in the DCL could augment the active slurry particles. This study offers valuable insights into the pad figure structure, simultaneously advancing our understanding of the pad surface topography and its influence on material removal. By focusing on both structural engineering and practical applications, this study paves the way for future research and enables further exploration in this field.