In this paper, a woven textile containing temperature and humidity sensors realized on flexible, plastic stripes is presented. The authors introduce two different sensors fabrication techniques: the first one consists of a conventional photolithography patterning technique; the second one, namely inkjet-printing, is here presented as an effective, low-cost alternative. In both cases, we obtain temperature and humidity sensors that can be easily integrated within a fabric by using a conventional weaving machine. All the sensors are fully characterized and the performances obtained with the two different fabrication techniques are compared and discussed, pointing out advantages and drawbacks resulting from each fabrication technique. The bending tests performed on these sensors show that they can be successfully woven without being damaged. A demonstrator, consisting of a mechanical support for the e-textile, a read-out electronic circuit, and a graphical PC interface to monitor the acquisition of humidity and temperature values, is also presented and described. This paper opens an avenue for real integration between printed electronics and traditional textile technology and materials. Printing techniques may be successfully used for the fabrication of e-textile devices, paving the way for the production of large area polymeric stripes and thus enabling new applications that, at the moment, cannot be developed with the standard lithography methods.

This work reports on the design, fabrication and characterization of an inkjet-printed multisensing platform on flexible polymeric substrates integrated into a printed semi-passive high frequency radio frequency identification (HF RFID) smart label. The printed platform was integrated after fabrication to the main RFID carrier, which contained an NFC RFID chip, a microprocessor, a readout frontend and a screen-printed circuitry and antenna. The multisensing platform has channels for capacitive vapor detection (i.e. humidity), two channels for resistive-based vapor detection (i.e. ammonia) with heating capability, and one resistive channel for temperature detection (RTD). A modular approach was employed where the sensing platform was integrated to the base RFID label carrier using foil-to-foil integration techniques compatible with large area fabrication. Besides wireless communication, the semi-passive label possesses data logging and the possibility of measuring all the sensors simultaneously through a direct readout circuitry. In addition to individual sensor characterization, the full functionality of the smart label was successfully demonstrated by measuring different temperature, humidity and ammonia levels.

Taking advantage of the sensor interface capabilities of a radio frequency identification (RFID) chip, the integration of different types of sensors on printed ultrahigh frequency (UHF) RFID tags is investigated. The design, development, and testing of printed smart sensing tags compatible with the RFID standard electronic product code Gen 2 is presented. Two different strategies are employed to interface the sensors: 1) passive single-chip and 2) semipassive architectures. Both strategies provide sensor data by directly answering to the RFID reader inquiries or using a data logging mechanism to store the sensor data in the RFID chip memory. Temperature readout is measured using the embedded sensor in the RFID chip. Additionally, a light sensor and pressure sensor interfaced to a microcontroller are implemented in the passive and semipassive tags versions, respectively. For the employed RFID chip, two different UHF antennas are designed and printed using inkjet and screen printing to compare their radio frequency performances. Finally, the fabricated smart tags are fully validated through measurements in an anechoic chamber and their behaviors are compared with numerical simulation. The screen printed semipassive RFID tag with loop antenna shows a better reading range than the inkjet-printed one, whereas the passive tag can be considered as the most cost-effective system.