Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.

Tactile or electronic skin is needed to provide critical haptic perception to robots and amputees, as well as in wearable electronics for health monitoring and wellness applications. Energy autonomy of skin is a critical feature that would enable better portability and longer operation times. This study shows a novel structure, consisting of a transparent tactile sensitive layer based on single‐layer graphene, and a photovoltaic cell underneath as a building block for energy‐autonomous, flexible, and tactile skin. Transparency of the touch sensitive layer is considered a key feature to allow the photovoltaic cell to effectively harvest light. Moreover, ultralow power consumed by the sensitive layer (20 nW cm⁻²) further reduces the photovoltaic area required to drive the tactile skin. In addition to its energy autonomy, the fabricated skin is sensitive to touch, mainly because a transparent polymeric protective layer, spin‐coated on the sensor's active area, makes the coplanar capacitor sensitive to touch, detecting minimum pressures of 0.11 kPa with a uniform sensitivity of 4.3 Pa⁻¹ along a broad pressure range. Finally, the tactile skin patches are integrated on a prosthetic hand, and the responses of the sensors for static and dynamic stimuli are evaluated by performing tasks, ranging from simple touching to grabbing of soft objects.

Flexible electronics has huge potential to bring revolution in robotics and prosthetics as well as to bring about the next big evolution in electronics industry. In robotics and related applications, it is expected to revolutionise the way with which machines interact with humans, real-world objects and the environment. For example, the conformable electronic or tactile skin on robot’s body, enabled by advances in flexible electronics, will allow safe robotic interaction during physical contact of robot with various objects. Developing a conformable, bendable and stretchable electronic system requires distributing electronics over large non-planar surfaces and movable components. The current research focus in this direction is marked by the use of novel materials or by the smart engineering of the traditional materials to develop new sensors, electronics on substrates that can be wrapped around curved surfaces. Attempts are being made to achieve flexibility/stretchability in e-skin while retaining a reliable operation. This review provides insight into various materials that have been used in the development of flexible electronics primarily for e-skin applications.

Inspired by the structure and functions of the human skin, a highly sensitive capacitive‐piezoelectric flexible sensing skin with fingerprint‐like patterns to detect and discriminate between spatiotemporal tactile stimuli including static and dynamic pressures and textures is presented. The capacitive‐piezoelectric tandem sensing structure is embedded in the phalange of a 3D‐printed robotic hand, and a tempotron classifier system is used for tactile exploration. The dynamic tactile sensor, interfaced with an extended gate configuration to a common source metal oxide semiconductor field effect transistor (MOSFET), exhibits a sensitivity of 2.28 kPa⁻¹. The capacitive sensing structure has nonlinear characteristics with sensitivity varying from 0.25 kPa⁻¹ in the low‐pressure range (<100 Pa) to 0.002 kPa⁻¹ in high pressure (≈2.5 kPa). The output from the presented sensor under a closed‐loop tactile scan, carried out with an industrial robotic arm, is used as latency‐coded spike trains in a spiking neural network (SNN) tempotron classifier system. With the capability of performing a real‐time binary naturalistic texture classification with a maximum accuracy of 99.45%, the presented bioinspired skin finds applications in robotics, prosthesis, wearable sensors, and medical devices.

Herein, the development of complex 3D intelligent structures such as robotic hands using innovative designs and multimaterial additive manufacturing technology is presented. The distal phalanges of the 3D printed hand presented herein have inherent soft capacitive touch or pressure sensors and embedded electronics. Materials such as thermoplastic polyurethane (TPU), silver paint, conductive polylactic acid composite, graphite ink, etc. are explored to develop five different variants of the sensors using a modified 3D printer, which is capable of extruding conductive ink, metal paste, and polymers. The best‐performing 3D printed soft capacitive touch sensors, formed with silver paint and soft rubber (Ecoflex 00‐30), are integrated on the distal phalanges of the 3D printed robotic hand. These sensors exhibit a stable response with sensitivity of 0.00348 kPa⁻¹ for pressure <10 kPa and 0.00134 kPa⁻¹ for higher pressure. To demonstrate the practical applicability, the 3D printed hand with embedded soft capacitive touch sensors is used for interacting with everyday objects. The tightly integrated sensing elements within the 3D printed structures, as presented herein, can pave the way for a new generation of truly smart material systems that can possibly change their appearance and shape autonomously.