A hybrid electrochemical energy storage device assembled with faradaic Bi ₂ O ₃ and MnO ₂ electrodes exhibits superior electrochemical performance with a high energy density of 79 W h kg ⁻¹ at a power density of 702 W kg ⁻¹ .

Plasma electrolytic oxidation (PEO) coating was obtained on AZ31 Mg alloy using a direct current in a sodium silicate-based electrolyte with and without a carbon nanotube (CNT) additive. The surface morphology and phase composition of the PEO coatings were investigated through field emission scanning electron microscopy (SEM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The corrosion-resistance properties of the PEO coatings were evaluated using potentiodynamic polarization measurements and electrochemical impedance spectroscopy (EIS) in a 3.5 wt.% NaCl solution. Furthermore, the heat-dissipation property was evaluated by a heat-flux measurement setup using a modified steady-state method and Fourier transform infrared spectroscopy (FT-IR). The results demonstrate that, by increasing the concentration of CNT additive in the electrolyte, the micropores and cracks of the PEO coatings are greatly decreased. In addition, the anticorrosion performance of the PEO coatings that incorporated CNT for the protection of the Mg substrate was improved. Finally, the coating’s heat-dissipation property was improved by the incorporation of CNT with high thermal conductivity and high thermal emissivity.

The heat dissipation of a metal heat sink for passive cooling can be enhanced by surface modifications to increase its thermal emissivity, which is reflected by a darker surface appearance. In this study, copper electrodeposition followed by heat treatment was applied to a copper substrate. The heat treatment formed a nanoporous oxide layer containing CuO and Cu₂O, which has a dark blackish color and therefore increased the thermal emissivity of the surface. The heat dissipation performance was evaluated using the sample as a heat sink for an LED module. The surface-treated copper heat sink with a high thermal emissivity oxide layer enhanced the heat dissipation of the LED module and allowed it to be operated at a lower temperature. With an increase in the heat treatment, the thermal emissivity increases to 0.865, but the thermal diffusivity is lower than the copper substrate by ~12%. These results indicate that the oxide layer is a thermal barrier for heat transfer, thus optimization between the oxide thickness and thermal emissivity is required by evaluating heat dissipation performance in operating conditions. In this study, an oxide layer with an emissivity of 0.857 and ~5% lower thermal diffusivity than the copper substrate showed the lowest LED operating temperature.

Superhydrophobic surfaces have great potential for various applications owing to their superior dewetting and mobility of water droplets. However, the physical robustness of nano/microscale rough surface structures supporting superhydrophobicity is critical in real applications. In this study, to create a superhydrophobic surface on copper, we employed copper electrodeposition to create a nano/microscale rough surface structure as an alternative to the nanoneedle CuO structure. The rough electrodeposited copper surface with a thin Teflon coating shows superhydrophobicity. The enhancement of dewetting and mobility of water droplets on copper surfaces by electrodeposition and hydrophobization significantly improved the condensation heat transfer by up to approximately 78% compared to that of copper substrates. Moreover, the nano/microscale rough surface structure of the electrodeposited copper surface exhibits better tolerance to physical rubbing, which destroys the nanoneedle-structured CuO surface. Therefore, the condensation heat transfer of the superhydrophobic electrodeposited copper surface decreased by only less than 10%, while that of the nanoneedle-structured CuO surface decreased by approximately 40%. This suggests that an electrodeposited copper surface can lead to the stable performance of superhydrophobicity for real applications.