Investigations of antimonide-based materials began at about the same time as HgCdTe ternary alloys—in the 1950s, and the apparent rapid success of their technology, especially low-dimensional solids, depends on the previous five decades of III-V materials and device research. However, the sophisticated physics associated with the antimonide-based bandgap engineering concept started at the beginning of 1990s gave a new impact and interest in development of infrared detector structures within academic and national laboratories. The development of InAs/GaSb type-II superlattices (T2SLs) results from two primary motivations: the perceived challenges of reproducibly fabricating high-operability HgCdTe focal plane arrays (FPAs) at reasonable cost and the theoretical predictions of lower Auger recombination for type T2SL detectors compared with HgCdTe. Second motivation—lower Auger recombination should be translated into a fundamental advantage for T2SL over HgCdTe in terms of lower dark current and/or higher operating temperature, provided other parameters such as Shockley-Read-Hall (SRH) lifetime are equal. InAs/GaSb T2SL photodetectors offer similar performance to HgCdTe at an equivalent cut-off wavelength, but with a sizeable penalty in operating temperature, due to the inherent difference in SRH lifetimes. It is predicted that since the future infrared (IR) systems will be based on the room temperature operation of depletion-current limited arrays with pixel densities that are fully consistent with background- and diffraction-limited performance due to the system optics, the material system with long SRH lifetime will be required. Since T2SLs are very much resisted in attempts to improve its SRH lifetime, currently the only material that meets this requirement is HgCdTe. Due to less ionic chemical bonding, III-V semiconductors are more robust than their II-VI counterparts. As a result, III-V-based FPAs excel in operability, spatial uniformity, temporal stability, scalability, producibility, and affordability—the so-called “ibility” advantages.

In 1959, Lawson and co-workers published the paper which triggered development of variable band gap Hg_1−xCd_xTe (HgCdTe) alloys providing an unprecedented degree of freedom in infrared detector design. HgCdTe ternary alloy has been used for realization of detectors operating under various modalities including: photoconductor, photodiode, and metal-insulator-semiconductor detector designs. Over the last five decades, this material system has successfully overcome the challenges from other material systems. It is important to notice that none of these competitors can compete in terms of fundamental properties. The competition may represent more mature technology but not higher performance or, with the exception of thermal detectors, higher operating temperatures (HOTs) for ultimate performance. In the last two decades, several new concepts for improvement of the performance of photodetectors have been proposed. These new concepts are particularly addressing the drive towards the so called HOT detectors aiming to increase detector operating temperatures. In this paper, new strategies in photodetector designs are reviewed, including barrier detectors, unipolar barrier photodiodes, multistage detectors and trapping detectors. Some of these new solutions have emerged as a real competitor to HgCdTe photodetectors.

In the last two decades, several new concepts for improving the performance of infrared detectors have been proposed. These new concepts particularly address the drive towards the so-called high operating temperature focal plane arrays (FPAs), aiming to increase detector operating temperatures, and as a consequence reduce the cost of infrared systems. In imaging systems with the above megapixel formats, pixel dimension plays a crucial role in determining critical system attributes such as system size, weight and power consumption (SWaP). The advent of smaller pixels has also resulted in the superior spatial and temperature resolution of these systems. Optimum pixel dimensions are limited by diffraction effects from the aperture, and are in turn wavelength-dependent. In this paper, the key challenges in realizing optimum pixel dimensions in FPA design including dark current, pixel hybridization, pixel delineation, and unit cell readout capacity are outlined to achieve a sufficiently adequate modulation transfer function for the ultra-small pitches involved. Both photon and thermal detectors have been considered. Concerning infrared photon detectors, the trade-offs between two types of competing technology—HgCdTe material systems and III–V materials (mainly barrier detectors)—have been investigated.

Since the discovery of graphene, its applications to electronic and optoelectronic devices have been intensively and thoroughly researched. Extraordinary and unusual electronic and optical properties make graphene and other two-dimensional (2D) materials promising candidates for infrared and terahertz (THz) photodetectors. Until now, however, 2D material-based performance is lower in comparison with those of infrared and terahertz detectors existing in the global market. This paper gives an overview of emerging 2D material detectors' performance and comparison with the traditionally and commercially available ones in different applications in high operating temperature conditions. The most effective single graphene detectors are THz detectors utilizing the plasma rectification effect in the field-effect transistors. Most of the 2D layered semiconducting material photodetectors operate in the visible and near-infrared regions, and generally, their high sensitivity does not coincide with the fast response time, which limits real detector functions.