Tungsten is an essential metal for the manufacture of special alloys, which is in constant demand due to the development of the industry. The recovery of scheelite from undeveloped tungsten ore in South Korea was investigated to improve the flotation performance for high grade and recovery of concentrate. To investigate the interaction between the flotation reagents and the minerals, the adsorption experiments of oleic acid as a collector on Ca-bearing minerals, such as scheelite, calcite, and fluorite were carried out. This reaction was confirmed chemical adsorption by analysis of zeta potential and FTIR analysis. The batch test was performed using a raw ore to enhance the grade and recovery of the scheelite concentrate. It was obtained at the optimal conditions for high WO₃ grade and recovery of scheelite concentrate by using a simple process. In particular, the sodium carbonate used as a pH modifier was investigated to increase scheelite flotation performance by supporting the selective depression of Ca-bearing gangue minerals. Furthermore, a locked cycle test (LCT) was carried out based on batch test results for the design of a continuous pilot plant.

Printed circuit boards (PCBs) are difficult to recycle because of the layered structure of non-metal (i.e., epoxy resin, glass fiber) and copper. In this work, we conducted a systematic investigation to effectively recover copper from PCB. A thermal treatment was employed for improving the crushing performance of PCB and conducted by varying the temperature and the gas. Then, the mechanical strength, degree of liberation (DL), and copper separation efficiency of the heat-treated and untreated PCBs were investigated. After heat treatment under a 300 °C air atmosphere, the mechanical strength of PCB decreased from 386.36 to 24.26 MPa, and copper liberation improved from 9.3% to 100% in the size range of a coarser size fraction (>1400 μm). Accordingly, when electrostatic separations were performed under these conditions, a high-Cu-grade concentrate and high recovery could be obtained. The results show that the change in the physical properties of the PCBs leads to an improvement in the DL following thermal decomposition at 300 °C in air. Our study elucidates the physical properties of PCBs and the DL under various heat treatment conditions. Furthermore, it shows that the heat treatment condition of 300 °C in air is ideal for recovering copper from the PCB.