The addition of fillers has been implemented in fused filament fabrication (FFF), and robust carbon fillers have been found to improve the mechanical, electrical, and thermal properties of 3D-printed matrices. However, in stretchable matrices, the use of fillers imposes significant challenges related to quality and durability. In this work, we show that long carbon staple fibers in the form of permeable carbon fiber cloth (CFC) can be placed into a stretchable thermoplastic polyurethane (TPU) matrix to improve the system. Four CFC sample series (nominally 53–159-µm-thick CFC layers) were prepared with a permeable and compliant thin CFC layer and a highly conductive and stiff thick CFC layer. The sample series was tested with single pull-up tests and cyclic tensile tests with 10,000 cycles and was further studied with digital image correlation (DIC) analyses. The results showed that embedded CFC layers in a TPU matrix can be used for stretchable 3D-printed electronics structures. Samples with a thin 53 µm CFC layer retained electrical properties at 50% cyclic tensile deformations, whereas the samples with a thick >150-µm CFC layer exhibited the lowest resistance (5 Ω/10 mm). Between those structures, the 106-µm-thick CFC layer exhibited balanced electromechanical properties, with resistance changes of 0.5% in the cyclic tests after the orientation of the samples. Furthermore, the suitability of the structure as a sensor was estimated.

Advances in flexible and hybrid electronics promote increasing demands for wearable sensors in personal health, monitoring, and diagnostic medical gadgets. Conventional wearable devices rely on electronics based on rigid substrates and components with limited conformity to user skin. In this work, we report a fully integrated, stretchable wireless electrocardiography (ECG) system developed on highly elastic, ultra-thin ( $100~\mu \text{m}$ ) thermoplastic polyurethane (TPU) film without any rigid or flexible interposer. Moreover, the circuit layout printing and component assembly are carried out through sheet-to-sheet (S2S) process directly on TPU film. This study utilizes both experimental reliability tests coupled with data acquired from finite element modeling (FEM) to assess performance and failure of the device under tensile loading. In such a complex system assembly, FEM simulation not only provides insights on the overall electromechanical performance of the device, but also facilitates localization of the failure points which are difficult to access for visual inspection. The performance of the device is also evaluated through controlled uniaxial cyclic strain at 5% and 10% elongation. The durability test shows that the assembled device can stay functional over hundreds of deformation cycles, suggesting that direct assembly of conventional components on stretchable substrate represents a promising approach for fully integrated stretchable devices, which is a step toward scalable manufacture of wearable stretchable electronics through high-throughput manufacturing processes.

The multiplicity of targets of the 5G and further future technologies, set by the modern societies and industry, lacks the establishment of design methods for the highly multidisciplinary application of wireless platforms for small cells. Constraints are set by the overall energy concept, structural safety and sustainability. Various Smart poles and Light poles exist but it is challenging to define the design drivers especially for a composite load-carrying structure. In this study, the design drivers of a composite 5G smart pole are determined and the connecting design between finite element modelling (FEM), signal penetration and computational fluid dynamics (CFD) for thermal analysis are reported as an interdisciplinary process. The results emphasize the significant effects of thermal loading on the material selection. The physical architecture, including various cutouts, is manipulated by the needs of the mmW radios, structural safety and the societal preferences of sustainable city planning, i.e., heat management and aesthetic reasons. Finally, the paint thickness and paint type must be optimized due to radome-integrated radios. In the future, sustainability regulations and realized business models will define the cost-structure and the response by customers.

Stretchable electronics promise to extend the application range of conventional electronics by enabling them to keep their electrical functionalities under system deformation. Within this framework, development of printable silver-polymer composite inks is making possible to realize several of the expected applications for stretchable electronics, which range from seamless sensors for human body measurement (e.g. health patches) to conformable injection moulded structural electronics. However, small rigid electric components are often incorporated in these devices to ensure functionality. Under mechanical loading, these rigid elements cause strain concentrations and a general deterioration of the system’s electrical performance. This work focuses on different strategies to improve electromechanical performance by investigating the deformation behaviour of soft electronic systems comprising rigid devices through Finite Element analyses. Based on the deformation behaviour of a simple stretchable device under tensile loading, three general strategies were proposed: local component encapsulation, direct component shielding, and strain dispersion. The FE behaviour achieved using these strategies was then compared with the experimental results obtained for each design, highlighting the reasons for their different resistance build-up. Furthermore, crack formation in the conductive tracks was analysed under loading to highlight its link with the evolution of the system electrical performance.

Recent advances in materials science and structural design have changed electronic applications from being bulky and rigid objects to small and soft products that have emerged for a wide range of applications, especially human-related products for which mechanical adoption is the key requirement. A typical stretchable application consists of small-sized, rigid IC-chips and passive components interconnected by conductive tracks on soft substrates. The early failure of such devices initiates from the rigid-soft interface due to the accumulation of stress. Therefore, special attention is needed to reduce the strain concentration at the interface. In this paper, stretchable interconnects were fabricated using a screen-printing method and surface mounted devices (SMDs) were bonded using an isotropic conductive adhesive. By partially removing material from the substrate in areas a little way from the rigid components, the stiffness is locally reduced, and this leads to an increase in the local stiffness around the SMDs and hence shields the soft-rigid interface against the stress. Materials can be removed by two different patterns. A finite element analysis and experimental data show 11%–19% improvements in single pull-up tests for the modified samples. This approach makes the electromechanical behaviour independent of encapsulation properties.