The statistics of electrical breakdown field (Ebd) of HfO2 and SiO2 thin films has been evaluated over multiple length scales using macroscopic testing of standardized metal-oxide-semiconductor (TiN∕SiO2∕Si) and metal-insulator-metal (TiN∕HfO2∕TiN) capacitors (10−2mm2–10μm2 area) on a full 200mm wafer along with conductive-atomic-force microscopy. It is shown that Ebd follows the same Weibull distribution when the data are scaled using the testing area. This overall scaling suggests that the defect density is ∼1015cm−2 and Ebd is ∼40MV∕cm for nanometer-length scales; as such, breakdown in these materials is most likely initiated by bond breaking rather than punctual defects.

Beryllium chalcogenides have a much higher degree of covalency than other II–VI compounds. Be containing ZnSe based mixed crystals show a significant lattice hardening effect. In addition, they introduce substantial additional degrees of freedom for the design of wide gap II–VI heterostructures due to their band gaps, lattice constants, and doping behavior. Therefore, these compounds seem to be very interesting materials for short wavelength laser diodes. Here, we report on the first fabrication of laser diodes based on the wide band gap II–VI semiconductor compound BeMgZnSe. The laser diodes emit at a wavelength of 507 nm under pulsed current injection at 77 K, with a threshold current of 80 mA, corresponding to 240 ${\mathrm{A/cm}}^{\mathrm{2}}$ .

Nonvolatile memory structures using Ge nanocrystals embedded in ${\mathrm{SiO}}_2$ have been characterized by room and low temperature current–voltage and capacitance–voltage measurements. The Ge nanocrystals have been fabricated by low pressure chemical vapor deposition process which is shown to be well suited for a real control of the tunnel oxide thickness. The deposition conditions allow a separate control of $\mathrm{nc-}\mathrm{Ge}$ density and size. Using capacitance–voltage characterizations on nonvolatile memory structures, we have measured the charging and discharging kinetics of holes for tunnel oxides in the range 1.2–2.5 nm. Using current–voltage measurements and simulations, we have also shown that $\mathrm{nc-}\mathrm{Ge}$ are at the origin of a tunnel-assisted current. Simulations have demonstrated that the hole’s charging effects strongly reduce the current density across the nonvolatile memory structure. Combined with a good control of $\mathrm{nc-}\mathrm{Ge}$ properties, the use of Ge dots with large diameters $\text{(>10\hspace{0.5em}}\mathrm{nm})$ seems to be a promising way for p-type memory applications.