Three-dimensional interconnect devices are still strongly related to plastic materials. Since the use of these materials is limited in harsh environments, there is an application gap, which could be filled by ceramic circuit carriers. Low-temperature cofired ceramics (LTCC) offer promising solutions to fill this gap. This work provides a feasibility study, including the whole technological chain of ceramic multilayer processing. Targeting a curved multilayer substrate, fully equipped with SMD (Surface-mounted device) components, the particularities of single process steps are investigated. Two shaping methods based on quartz glass molds are compared with regard to shape fidelity and technological effort. The investigation of internal conductor lines and via connections reveals that the metallization should have a minimum width of 200 µm and the via diameter is limited to 150 µm. Further considerations focus on the possible footprint of components and use of cavities to increase the footprint of components. The limits of wire bonding on curved surfaces were inspected. Finally, the work presents a demonstrator of a fully equipped four-layer ceramic circuit, including internal wiring. Hence, the transfer of the 2.5-dimensional multilayer ceramic technology into the third dimension is proven.