Low temperature co-fired ceramics (LTCC) is being widely used for microwave circuits. The BMBF funded R&D-project KERAMIS focuses on larger implementation of functionality in LTCC substrates to allow designs with "standard" MMICs. Target applications are circuits for multimedia satellite communications. In order to add more functionality in LTCC, current patterning limits of line width and line separation (100 mum) need to be extended. Four different technologies are considered candidates for higher resolution: a) fine line printing technology with special screens, b) photo-imageable pastes, c) etching of thick film conductors (co- and post-fired) and d) thin films on LTCC. For this purpose, a test coupon was designed and manufactured by the consortium members. The artwork contains lines, line transitions, ring resonators (microstrip and stripline), edge-coupled filters, DC blocking structures, and various lines for DC resistance testing. The smallest gap definition is 50 mum. Two substrate materials, Du Pont tape 951 and 943, are included in the study. Besides the main frequency band of interest in the project (17-22 GHz), these structures have been characterised up to 50 GHz. Electrical results are correlated to physical measurements of the features (line width, spaces and tolerances). Data are evaluated with respect to performance, manufacturability, and yield

In order to introduce new bonding methods in the area of electronic packaging a theoretical analysis was conducted, which should give substantial information about the potential of reactive multilayer systems (rms) to create sufficient local heat for joining processes between silicon chips and ceramic substrates. For this purpose, thermal CFD (computational fluid dynamics) simulations have been carried out to simulate the temperature profile of the bonding zone during and after the reaction of the rms. This thermal analysis considers two different configurations. The first configuration consists of a silicon chip that is bonded to an LTCC-substrate (Low Temperature Co-fired Ceramics) using a bonding layer that contains an rms and a solder preform. The reaction propagation speed of the reactive multilayer was set to a value of 1 m/s, in order to partially melt a solder preform underneath a silicon chip. The second configuration, which consists only of the LTCC-substrate and the rms, was chosen to study the differences between the thermal outputs of the two arrangements. The analysis of the CFD simulations was particularly focused on interpretations of the temperature and liquid fraction contours. The CFD thermal simulation analysis conducted contains a melting/solidification model which can track the molten/solid state of the solder in addition to modelling the influence of latent heat. To provide information for the design of a test-substrate for experimental investigations, the real behaviour of Pt-100 temperature probes on the LTCC-substrate was simulated, in order to monitor an actual bonding in the experiment. All simulations were carried out using the ANSYS Fluent software.

Multi-electrode arrays find application in electrophysiological recordings. The quality of the captured signals depends on the interfacial contact between electrogenic cells and the electronic system. Therefore, it requires reliable low-impedance electrodes. Low-temperature cofired ceramic technology offers a suitable platform for rapid prototyping of biological reactors and can provide both stable fluid supply and integrated bio-hardware interfaces for recordings in electrogenic cell cultures. The 3D assembly of thick film gold electrodes in in vitro bio-reactors has been demonstrated for neuronal recordings. However, especially when dimensions become small, their performance varies strongly. This work investigates the influence of different coatings on thick film gold electrodes with regard to their influence on impedance behavior. PEDOT:PSS layer, titanium oxynitride and laminin coatings are deposited on LTCC gold electrodes using different 2D and 3D MEA chip designs. Their impedance characteristics are compared and discussed. Titanium oxynitride layers emerged as suitable functionalization. Small 86-µm-electrodes have a serial resistance R_s of 32 kOhm and serial capacitance C_s of 4.1 pF at 1 kHz. Thick film gold electrodes with such coatings are thus qualified for signal recording in 3-dimensional in vitro cell cultures.

Low-temperature co-fired ceramic (LTCC) are widely acknowledged for wide-band and microwave circuits. Within the project consortium KERAMIS, implementation of higher functionality in LTCC substrates is being investigated. Among the applications considered are a 4 × 4 switch matrix [1], voltage-controlled oscillators [2], and amplifiers for multimedia satellite communications working in Ka-band. In order to add more functionality (e.g., filters, couplers) in LTCC, current patterning limits of line width and line separation need to be extended. Four different technologies were considered for higher resolution: a) fine-line printing technology with special screens, b) photo-imageable pastes, c) etching of thick-film conductors (co- and post-fired), and d) thin films on LTCC. Evaluation of patterning technologies is based on a test coupon that was designed and manufactured by the consortium members. The artwork contains lines, line transitions, ring resonators (microstrip and stripline), edge-coupled filters, DC blocking structures, and various lines for DC resistance testing. The smallest gap definition is 50 μm. Two substrate materials, Du Pont tapes 951 and 943, are included in the study. In addition to the main frequency band of interest in the project (17–22 GHz), these structures have been characterized up to 50 GHz. Electrical results are correlated to physical measurements of the structures (line width, spaces, and tolerances) and are evaluated with respect to performance, manufacturability, and yield. Results show excellent performance for screen-printed structures and demonstrated the importance of mask tuning to achieve optimum resolution (under etching etc.).

Reactive bonding can overcome the issues associated with conventional soldering processes, such as potential damage to heat-sensitive components and the creation of thermomechanical stress due to differing coefficients of thermal expansion. The risk of such damage can be reduced by using localized heat sources like reactive multilayer systems (RMS), which is already a well-established option in the field of silicon or metal bonding. Adapting this process to other materials, such as low temperature co-fired ceramics (LTCC), is difficult due to their differing properties, but it would open new technological possibilities. One aspect that significantly affects the quality of the bonding joints is the pressure applied during the bonding process. To investigate its influence more closely, various LTCC samples were manufactured, and cross-sections were prepared. The microscopical analysis reveals that there is an optimum range for the bonding pressure. While too little pressure results in the formation of lots of voids and gaps, most likely in poor mechanical and electrical properties, too high pressure seems to cause a detachment of the metallization from the base material.

Low temperature cofired ceramics (LTCC) provide a technology for the 3-dimensional integration of sensor arrays into bioreactors covering dimensions of several hundred micrometers. Since optical control in such assemblies is not possible, the in situ detection of cell adhesion on impedance electrodes with high spatial resolution would deliver crucial information. A current limitation is the increasing impedance of microelectrodes with decreasing diameter. This study evaluates the suitability of thick film gold electrodes, pristine and coated with electropolymerized poly(3,4-ethylenedioxythiophene) (PEDOT), for the detection of cell adhesion on the electrode surface. The impedance as criterion for cell attachment is measured with a recording system for electroactive cells with the aim of improving usability. Two cell cultures with different adhesion characteristic are used for adhesion assessment on planar test chips. The impedance increase measured on individual PEDOT coated electrodes due to tight contact of cells reaches a factor of 6.8 in cultures of well-adherent HepG2 cells. Less adhered NG108-15 cells produce a maximum impedance increase by a factor of 2.6. Since the electrode impedance is significantly reduced by PEDOT coating, a reduction of the electrode diameter to values below 100 µm and spatially resolved detection is possible. The results encourage further studies using PEDOT coated thick film electrodes as bio-electronic-interfaces. We presume that such miniaturized electrodes are suitable for 3-dimensional recordings in electroactive cell cultures, providing information of local cell adhesion at the same time.