Prof. Chih Chen is the Chair Professor at the Department of Materials Science and Engineering at National Yang Ming Chiao Tung University. He completed his Ph.D. in Materials Science at the University of California, Los Angeles (UCLA) in 1999. He joined NYCU Taiwan in 2000 and served as the Chairman of the Department of Materials Science and Engineering from February 2017 to January 2023. He discovered the electrodeposition of (111)-oriented nanotwinned copper and transferred the technology to Chemleaders, Inc. in Taiwan for mass production in 2016. His research interests include low-temperature Cu-to-Cu direct bonding, high-strength nanotwinned copper lines and films for 3D IC integration, and the reliability of flip-chip solder joints and microbumps for microelectronics packaging, including electromigration, thermomigration, and metallurgical reactions.