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Waste from information technology (IT) and telecommunication equipment (WITTE) constitutes a significant fraction of waste from electrical and electronic equipment (WEEE). The presence of rare metals and hazardous materials (e.g., heavy metals or flame retardants) makes the necessary recycling procedures difficult and expensive. Important efforts are being made for Waste Printed Circuit Board (WPCB) recycling because, even if they only amount to 5–10% of the WITTE weight, they constitute up to 80% of the recovered value. This paper summarizes the recycling techniques applicable to WPCBs. In the first part, dismantling and mechanical recycling techniques are presented. Within the frame of electro-mechanical separation technology, the chain process of shredding, washing, and sieving, followed by one or a combination of magnetic, eddy current, corona electrostatic, triboelectrostatic, or gravity separation techniques, is presented. The chemical and electrochemical processes are of utmost importance for the fine separation of metals coming from complex equipment such as WPCBs. Thermal recycling techniques such as pyrolysis and thermal treatment are presented as complementary solutions for achieving both an extra separation stage and thermal energy. As the recycling processes of WPCBs require adequate, efficient, and ecological recycling techniques, the aim of this survey is to identify and highlight the most important ones. Due to the high economic value of the resulting raw materials relative to the WPCBs’ weight and composition, their recycling represents both a necessary environmental protection action, as well as an economic opportunity.
Horațiu Vermeșan; Ancuța-Elena Tiuc; Marius Purcar. Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards. Sustainability 2019, 12, 74 .
AMA StyleHorațiu Vermeșan, Ancuța-Elena Tiuc, Marius Purcar. Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards. Sustainability. 2019; 12 (1):74.
Chicago/Turabian StyleHorațiu Vermeșan; Ancuța-Elena Tiuc; Marius Purcar. 2019. "Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards." Sustainability 12, no. 1: 74.
Thermal Induced Plastic Metal Deformation (TPMD) in a double-diffused metal-oxide semiconductor (DMOS) power device is highly dependent on the design and material properties of the metallization system corresponding to the technology in which the device is fabricated. To analyse and understand the interactions between the temperature, stress and strain distribution in the metallization system, a simple substructure model is necessary. A simple three-dimensional (3D) substructure commonly found in high integration Bipolar-CMOS-DMOS (BCD) technologies, is introduced for the assessment of thermo-mechanical phenomena. The investigated substructure is represented by a repetitive model with three signal metallisation lines. Numerical simulations based on finite element method (FEM) are performed to identify the areas of high stress accumulation and possible failure mechanisms. The structure is studied under two temperature variation conditions: 400–600 K and 300–650 K. Function of different electrical connectivity between metal layers, the displacement profile is analysed for identifying possible failure regions. First, an analysis of the mechanical displacement during one heating-cooling cycle is studied to understand the behaviour of the structure as response to the lateral temperature gradient. Further, the analysis is extended to a larger number of cycles to understand the plastic deformation accumulation over repeated cycling operation. Based on the displacement accumulation profiles, the possible failure positions and failure mechanisms are identified.
Adrian Bojita; Marius Purcar; Cristian Boianceanu; Ciprian Florea; Dan Simon; Vasile Topa. A Simple Metal-Semiconductor Substructure Model for the Thermal Induced Fatigue Simulation in Power Integrated Circuits. Proceedings of the 2nd Annual International Conference on Material, Machines and Methods for Sustainable Development (MMMS2020) 2018, 21 -36.
AMA StyleAdrian Bojita, Marius Purcar, Cristian Boianceanu, Ciprian Florea, Dan Simon, Vasile Topa. A Simple Metal-Semiconductor Substructure Model for the Thermal Induced Fatigue Simulation in Power Integrated Circuits. Proceedings of the 2nd Annual International Conference on Material, Machines and Methods for Sustainable Development (MMMS2020). 2018; ():21-36.
Chicago/Turabian StyleAdrian Bojita; Marius Purcar; Cristian Boianceanu; Ciprian Florea; Dan Simon; Vasile Topa. 2018. "A Simple Metal-Semiconductor Substructure Model for the Thermal Induced Fatigue Simulation in Power Integrated Circuits." Proceedings of the 2nd Annual International Conference on Material, Machines and Methods for Sustainable Development (MMMS2020) , no. : 21-36.
The metallization of double-diffused metal-oxide semiconductor (DMOS) power devices, which operate under fast thermal cycling (FTC), undergoes thermal induced plastic metal deformation (TPMD). The design of the metallization has a significant impact on the device lifetime and thus requires a thorough understanding of the temperature, stress and strain distribution. A simple three-dimensional (3D) transistor substructure which is commonly found in various high integration Bipolar-CMOS-DMOS (BCD) technologies is analysed. The thermomechanical behaviour is studied with the finite element method (FEM) for investigation of two potential failure mechanisms: delamination of power metal and accumulation of plastic deformation in signal metallization layer (which leads to inter-metal dielectric cracking). These failure mechanisms are analysed on two versions of the structure: the first one has only signal and power metal lines and the second one has vias, in addition to the signal and power metal lines. The target of the paper is to propose an efficient finite element analysis (FEA) model that can be used for a qualitative assessment of thermo-mechanical phenomena in the metal system of high integration BCD technologies.
Ioan-Adrian Bojita; Cristian Boianceanu; Marius Purcar; Ciprian Florea; Dan Simon; Cosmin-Sorin Plesa. A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits. Microelectronics Reliability 2018, 87, 142 -150.
AMA StyleIoan-Adrian Bojita, Cristian Boianceanu, Marius Purcar, Ciprian Florea, Dan Simon, Cosmin-Sorin Plesa. A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits. Microelectronics Reliability. 2018; 87 ():142-150.
Chicago/Turabian StyleIoan-Adrian Bojita; Cristian Boianceanu; Marius Purcar; Ciprian Florea; Dan Simon; Cosmin-Sorin Plesa. 2018. "A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits." Microelectronics Reliability 87, no. : 142-150.
Alexandru Avram; Marius Purcar; Vasile Topa; Calin Munteanu. XFEM BASED ALGORITHM FOR NUMERICAL OPTIMIZATION OF CURRENT DENSITY IN ELECTROCHEMICAL APPLICATIONS. Environmental Engineering and Management Journal 2016, 15, 2587 -2594.
AMA StyleAlexandru Avram, Marius Purcar, Vasile Topa, Calin Munteanu. XFEM BASED ALGORITHM FOR NUMERICAL OPTIMIZATION OF CURRENT DENSITY IN ELECTROCHEMICAL APPLICATIONS. Environmental Engineering and Management Journal. 2016; 15 (12):2587-2594.
Chicago/Turabian StyleAlexandru Avram; Marius Purcar; Vasile Topa; Calin Munteanu. 2016. "XFEM BASED ALGORITHM FOR NUMERICAL OPTIMIZATION OF CURRENT DENSITY IN ELECTROCHEMICAL APPLICATIONS." Environmental Engineering and Management Journal 15, no. 12: 2587-2594.
Calin Munteanu; Adina Racasan; Vasile Topa; Marius Purcar; Laura Grindei. COMPUTATION OF THE POTENTIAL INDUCED ON THE FLUID TRANSPORT PIPELINES BY OVERHEAD HIGH VOLTAGE LINES. Environmental Engineering and Management Journal 2011, 10, 505 -510.
AMA StyleCalin Munteanu, Adina Racasan, Vasile Topa, Marius Purcar, Laura Grindei. COMPUTATION OF THE POTENTIAL INDUCED ON THE FLUID TRANSPORT PIPELINES BY OVERHEAD HIGH VOLTAGE LINES. Environmental Engineering and Management Journal. 2011; 10 (4):505-510.
Chicago/Turabian StyleCalin Munteanu; Adina Racasan; Vasile Topa; Marius Purcar; Laura Grindei. 2011. "COMPUTATION OF THE POTENTIAL INDUCED ON THE FLUID TRANSPORT PIPELINES BY OVERHEAD HIGH VOLTAGE LINES." Environmental Engineering and Management Journal 10, no. 4: 505-510.