Hyung Duk Yun

Mr. Hyung Duk Yun


Research Focus & Metrics

Academic Career Length

11Years (2016-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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8 January 2016 in Metals
Verified
Journal Article
Open access
PDF file
HYHyung Duk Yun
Hyung Duk Yun
DSDuck Min Seo
Duck Min Seo
MLMin Yoeb Lee
Min Yoeb Lee
SKSoon-Yong Kwon
Soon-Yong Kwon
LPLee Soon Park
Lee Soon Park
Silver nanowires (AgNWs) with high aspect ratio were obtained utilizing a tapered tubular reactor by the polyol process. The tapered tubular type flow reactor allowed us to obtain nanowires in high yield without defects that is generally encountered in a closed reactor due to excessive shearing for a long time. After reaction the AgNWs were precipitated in the aqueous solution with the aid of a hydrogen bond breaker and were recovered effectively without using a high-cost centrifugation process. Dispersion of the AgNWs were used to prepare transparent conducting electrode (TCE) films by a spray coating method, which showed 86% transmittance and 90 Ωsq−1 sheet resistance.

16 May 2017 in Metals
Verified
Journal Article
Open access
PDF file
HNHyun Min Nam
Hyun Min Nam
DSDuck Min Seo
Duck Min Seo
HYHyung Duk Yun
Hyung Duk Yun
TGThangavel Gurunathan
Thangavel Gurunathan
LPLee Soon Park
Lee Soon Park
NYNam Su yong
Nam Su yong
Transparent conducting electrode film is highly desirable for application in touch screen panels (TSPs), flexible and wearable displays, sensors, and actuators. A sputtered film of indium tin oxide (ITO) shows high transmittance (90%) at low sheet resistance (50 Ω/cm2). However, ITO films lack mechanical flexibility, especially under bending stress, and have limitation in application to large-area TSPs (over 15 inches) due to the trade-off in high transmittance and low sheet resistance properties. One promising solution is to use metal mesh-type transparent conducting film, especially for touch panel application. In this work, we investigated such inter-related issues as UV imprinting process to make a trench layer pattern, the synthesis of core-shell-type Ag and Cu@Ag composite nanoparticles and their paste formulation, the filling of Ag and Cu@Ag mixture nanoparticle paste to the trench layer, and touch panel fabrication processes.