Temperature has a great influence on the normal operation and service life of high-power electronic components. To cope with the increasingly severe heat problems in integrated circuits, an enhanced heat transfer factor E is introduced to evaluate the comprehensive heat transfer performance of microchannel heat sinks (MCHS). The computational fluid dynamics (CFD) software was used to numerically study the fluid flow and heat transfer characteristics in the cone-column combined heat sink. The research results obtained the velocity field and pressure field distribution of the heat sink structure in the range of 100 ≤ Re ≤ 700. When Re changes, the change law of pressure drop ΔP, friction factor f, average Nussel number Nu_ave, average substrate temperature T, and enhanced heat transfer factor E, are compared with the circular MCHS. The results show that the uniform arrangement of the cones inside the cone-column combined heat sink can change the flow state of the cooling medium in the microchannel and enhance the heat transfer. In the range of 100 ≤ Re ≤ 700, the base temperature of the cone-column combined heat sink is always lower than the base temperature of the circular MCHS, and the average Nusselt number Nu_ave is as high as 2.13 times that of the circular microchannel. The enhanced heat factor E is 1.75 times that of the circular MCHS, indicating that the comprehensive heat transfer performance of the cone-column combined heat sink is significantly better than that of the circular microchannel.

The fluid flow in the small pore throat is a nonlinear flow, and the microscopic force between the fluid and the wall cannot be ignored. However, the previously established theories about the leakage between sealing interfaces have not considered the influence of microscopic forces. Based on contact mechanics and percolation theory, the void characteristics of the sealing interface were clarified, and the influence of microscopic force on fluid flow in porous medium was analyzed. Combined with the capillary force, the concept of a critical void radius between the mechanical seal interfaces is proposed. The fluid flow resistance model and leakage rate calculation equation of the sealing interface considering the van der Waals force are established, and the leakage judgment criterion of the sealing interface is provided. Through numerical calculation and experiments, the effect of microscopic force is verified in terms of the fluid flow law and macroscopic leakage rate. The results show that van der Waals forces have an important influence on the fluid flow between the sealing interfaces. As the microchannel size decreases, the van der Waals forces between solid and liquid increase, and the influence of these van der Waals forces on the fluid flow between the sealing interfaces cannot be ignored. The calculation model of the sealing interface leakage rate proposed in this paper shows little difference with the results of the Persson model, and is in good agreement with the experimental results; the maximum relative error is 8.7%, the minimum relative error is only 3.8%.

The primary purpose of this paper is to study the size effect of surface roughness and realize the quantitative description of the surface roughness in micro-forming process. This work is a continuation of the previous work by the authors. The effects of the initial surface roughness of the specimen, the grain size, and grain orientations on the surface roughness of micro-upsetting products were investigated. The ratio of the number of grains of the surface layer to the total number of grains was adopted to characterize the size effect. The variation of the size effect on the contact normal pressure during the compression process was also analyzed. And the quantitative description of the evolution law of surface roughness for micro-formed parts was realized. The corresponding micro compression experiment was done in order to testify the prediction model.

The effects of compound plasticizer urea/caprolactam (UC) on the diffusion behavior of water in mixtures with poly(vinyl alcohol) (PVA) were studied using a Molecular Dynamics (MD) simulation method. Five simulation models of PVA composites with different plasticizer contents were constructed to investigate the variation of the intermolecular interaction as well as the diffusion behavior of water molecules. Results showed that the predominant interaction between the functional groups of UC and PVA consisted of hydrogen bonds. As the plasticizer content increased, diffusion coefficients of water in PVA systems increased due to the comparably weak diffusion resistance. It was also found that the rotation of the PVA chains and the small molecules became faster with increasing UC content, and the relaxation time became shorter.