Eiji Iwase

Dr. Eiji Iwase

orcid

Research Focus & Metrics

Academic Career Length

24Years (2003-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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5 December 2005 in Journal of Microelectromechanical Systems
Verified
Journal Article
Closed access
EIEiji Iwase
Eiji Iwase
ISIsao Shimoyama
Isao Shimoyama
In this paper, we have developed a process for multistep sequential batch assembly of complex three-dimensional (3-D) ferromagnetic microstructures. The process uses the magnetic torque generated by an external magnetic field perpendicular to the substrate to lift hinged structures. We found that a dimensionless factor that depends on the volume of the magnetic material and the stiffness of the hinges determines the sensitivity of the hinged microstructures to a magnetic field. This factor was used as a criterion in designing a process for sequential batch assembly, i.e., for setting appropriate differences in sensitivity. Using a dimensionless factor in the design of the sequential assembly simplified the assembly process, which requires only placing the structures on a permanent magnet, and which can be used to carry out multistep sequential batch assembly. We fabricated hinged microstructures, which consist of 4.5-/spl mu/m-thick electroplated Permalloy plates and 200-nm-thick nickel elastic hinges of various sizes. In an experiment, four plates (600 /spl mu/m/spl times/800 /spl mu/m) were lifted sequentially and out-of-plane microstructures were assembled in a four-step process. Assembly of more complex out-of-plane microstructures (e.g., regular tetrahedrons, 800 /spl mu/m long on one side) was also shown to be feasible using this method of sequential batch assembly. [1351].

7 June 2010 in Journal of Micromechanics and Microengineering
Verified
Journal Article
Closed access
STSeiichi Takamatsu
Seiichi Takamatsu
TTTomoyuki Takahata
Tomoyuki Takahata
MMMasato Muraki
Masato Muraki
EIEiji Iwase
Eiji Iwase
KMKiyoshi Matsumoto
Kiyoshi Matsumoto
ISIsao Shimoyama
Isao Shimoyama

25 January 2017 in IEEE Robotics and Automation Letters
Verified
Journal Article
Open access
HSHiroki Shigemune
Hiroki Shigemune
SMShingo Maeda
Shingo Maeda
VCVito Cacucciolo
Vito Cacucciolo
YIYoshitaka Iwata
Yoshitaka Iwata
EIEiji Iwase
Eiji Iwase
SSShigeki Sugano
Shigeki Sugano
Effective design and fabrication of 3-D electronic circuits are among the most pressing issues for future engineering. Although a variety of flexible devices have been developed, most of them are still designed two-dimensionally. In this letter, we introduce a novel idea to fabricate a 3-D wiring board. We produced the 3-D wiring board from one desktop inkjet printer by printing conductive pattern and a 2-D pattern to induce self-folding. We printed silver ink onto a paper to realize the conductive trace. Meanwhile, a 3-D structure was constructed with self-folding induced by water-based ink printed from the same printer. The paper with the silver ink self-folds along the printed line. The printed silver ink is sufficiently thin to be flexible. Even if the silver ink is already printed, the paper can self-fold or self-bend to consist the 3-D wiring board. A paper scratch driven robot was developed using this method. The robot traveled 56 mm in 15 s according to the vibration induced by the electrostatic force of the printed electrode. The size of the robot is 30 × 15 × 10 mm. This work proposes a new method to design 3-D wiring board, and shows extended possibilities for printed paper mechatronics.

25 May 2012 in Journal of Micromechanics and Microengineering
Verified
Journal Article
Open access
EIEiji Iwase
Eiji Iwase
PHPui-Chuen Hui
Pui-Chuen Hui
DWDavid Woolf
David Woolf
ARAlejandro W Rodriguez
Alejandro W Rodriguez
SJSteven G Johnson
Steven G Johnson
MLMarko Lončar
Marko Lončar

15 March 2013 in Optics Express
Verified
Journal Article
Open access
PDF file
DWDavid Woolf
David Woolf
PHPui-Chuen Hui
Pui-Chuen Hui
EIEiji Iwase
Eiji Iwase
MKMughees Khan
Mughees Khan
ARAlejandro W. Rodriguez
Alejandro W. Rodriguez
MLMarko Loncar
Marko Loncar
We present here an optomechanical system fabricated with novel stress management techniques that allow us to suspend an ultrathin defect-free silicon photonic-crystal membrane above a Silicon-on-Insulator (SOI) substrate with a gap that is tunable to below 200 nm. Our devices are able to generate strong attractive and repulsive optical forces over a large surface area with simple in- and out- coupling and feature the strongest repulsive optomechanical coupling in any geometry to date (gOM/2π ≈ −65 GHz/nm). The interplay between the optomechanical and photo-thermal-mechanical dynamics is explored, and the latter is used to achieve cooling and amplification of the mechanical mode, demonstrating that our platform is well-suited for potential applications in low-power mass, force, and refractive-index sensing as well as optomechanical accelerometry.

11 January 2019 in Optics Express
Verified
Journal Article
Closed access
PDF file
YYYuta Yoshimizu
Yuta Yoshimizu
EIEiji Iwase
Eiji Iwase
We proposed a new type of dihedral corner reflector array (DCRA) called “radially arranged DCRA”. Our radially arranged DCRA could display a floating, three-dimensional image with a wide viewing angle without producing virtual images because dihedral corner reflectors were radially arranged for the designed paths of rays. In this research, we designed a reflector array pattern and evaluated the viewing angle of the floating image displayed by our radially arranged DCRA. During evaluation, we measured the reflection ratio of the radially arranged DCRA and demonstrated a floating image. Compared with a conventional DCRA, our radially arranged DCRA could expand the viewing angle from ± 30° to ± 90° without producing virtual images.