Direct laser deposition technology is used for the manufacture of large-size products with complex geometries. As a rule, trial samples with small dimensions are made to determine the deposition parameters. In order for the resulting products to have the required performance characteristics, it is necessary to minimize the number of internal macrodefects. Non-fusion between the tracks are defects that depend on the technological mode (power, speed, track width, etc.). In this work, studies have been carried out to determine the power level at which non-fusion is formed, dwell time between the tracks on the model samples. This paper considers the issue of transferring the technological parameters of direct laser deposition from model samples to a large-sized part, and describes the procedure for making model samples.

An analytical model has been developed for calculating three-dimensional transient temperature fields arising in the direct deposition process to study the thermal behavior of multi-track walls with various configurations. The model allows the calculation of all characteristics of the temperature fields (thermal cycles, cooling rates, temperature gradients) in the wall during the direct deposition process at any time. The solution of the non-stationary heat conduction equation for a moving heat source is used to determine the temperature field in the deposited wall, taking into account heat transfer to the environment. The method considers the size of the wall and the substrate, the change in power from layer to layer, the change in the cladding speed, the interpass dwell time (pause time), and the heat source trajectory. Experiments on the deposition of multi-track block samples are carried out, as a result of which the values of the temperatures are obtained at fixed points. The proposed model makes it possible to reproduce temperature fields at various values of the technological process parameters. It is confirmed by comparisons with experimental thermocouple data. The relative difference in the interlayer temperature does not exceed 15%.