The development of more recyclable materials is a key requirement for a transition towards a more circular economy. Thanks to exchange reactions, vitrimer, an attractive alternative for recyclable materials, is an innovative class of polymers that is able to change its topology without decreasing its connectivity. In this work, a bisphenol compound (VP) was prepared from saturated cardanol, i.e., 3−pentadecylphenol and vanillyl alcohol. Then, VP was epoxidized to obtain epoxide (VPGE). Finally, VPGE and citric acid (CA) were polymerized in the presence of catalyst TBD to prepare a fully bio−based vitrimer based on transesterification. The results from differential scanning calorimetry (DSC) showed that the VPGE/CA system could be crosslinked at around 163 °C. The cardanol−derived vitrimers had good network rearrangement properties. Meanwhile, because of the dynamic structural elements in the network, the material was endowed with excellent self−healing, welding, and recyclability.

Tuning the high properties of segregated conductive polymer materials (CPCs) by incorporating nanoscale carbon fillers has drawn increasing attention in the industry and academy fields, although weak interfacial interaction of matrix-filler is a daunting challenge for high-loading CPCs. Herein, we present a facile and efficient strategy for preparing the segregated conducting ultra-high molecular weight polyethylene (UHMWPE)-based composites with acceptable mechanical properties. The interfacial interactions, mechanical properties, electrical properties and electromagnetic interference (EMI) shielding effectiveness (SE) of the UHMWPE/conducting carbon black (CCB) composites were investigated. The morphological and Raman mapping results showed that UHMWPE/high specific surface area CCB (h-CCB) composites demonstrate an obviously interfacial transition layer and strongly interfacial adhesion, as compared to UHMWPE/low specific surface area CCB (l-CCB) composites. Consequently, the high-loading UHMWPE/h-CCB composite (beyond 10 wt% CCB dosage) exhibits higher strength and elongation at break than the UHMWPE/l-CCB composite. Moreover, due to the formation of a densely stacked h-CCB network under the enhanced filler-matrix interfacial interactions, UHMWPE/h-CCB composite possesses a higher EMI SE than those of UHMWPE/l-CCB composites. The electrical conductivity and EMI SE value of the UHMWPE/h-CCB composite increase sharply with the increasing content of h-CCB. The EMI SE of UHMWPE/h-CCB composite with 10 wt% h-CCB is 22.3 dB at X-band, as four times that of the UHMWPE/l-CCB composite with same l-CCB dosage (5.6 dB). This work will help to manufacture a low-cost and high-performance EMI shielding material for modern electronic systems.