Hyunwoong Kim received a B.Sc. degree in Electrical Engineering from Inha university, Incheon, South Korea, in 2018, and an M.Sc. degree from The Cho Chun Shik Graduate School of Green Transportation, Korea Advanced Institute of Science and Technology, Daejeon, in 2020. He is currently pursuing a Ph.D. degree with the Korea Advanced Institute of Science and Technology. His research interests include design, modeling, and analysis of through-silicon vias (TSVs) and silicon interposers for high-bandwidth memory considering signal integrity and power integrity.