CuO nanocrystals with as-designed morphologies such as uniform quasi-spherical nanoparticles and high-purity nanoleaves were synthesized by adjusting the addition of sodium hydroxide and hydrazine hydrate in aqueous solution at room temperature (25 °C). The increase of sodium hydroxide would accelerate the reaction rate and favor the nucleation of CuO nanocrystals. The decrease of the surface energy will promote the oriented attachment of nanocrystallites along the [−111] direction into nanowires and the final formation of two dimensional (2D) nanoleaves. Increasing the quantity of hydrazine hydrate could decrease the solution system energy and promote the aggregation of CuO nanocrystals from 2D nanoleaves into 3D quasi-spherical nanoparticles. All the CuO nanocrystals with different morphologies were characterized via transmission electron microscopy (TEM), field emission scanning electron microscopy (FESEM) and X-ray diffraction (XRD). The CuO nanoleaves exhibit excellent gas sensing performance in response to ethanol, showing the strongest response value of 8.22 at 1500 ppm ethanol for ∼260 °C.

A novel functional KH₂PO₄ (KDP) aqueous solution-in-oil (KDP aq/O) microemulsion system for KDP crystal ultra-precision chemical-mechanical polishing (CMP) was prepared. The system, which consisted of decanol, Triton X-100, and KH₂PO₄ aqueous solution, was available at room temperature. The functional KDP aq/O microemulsion system was systematically studied and applied as polishing solution to KDP CMP technology. In this study, a controlled deliquescent mechanism was proposed for KDP polishing with the KDP aq/O microemulsion. KDP aqueous solution, the chemical etchant in the polishing process, was caged into the micelles in the microemulsion, leading to a limitation of the reaction between the KDP crystal and KDP aqueous solution only if the microemulsion was deformed under the effect of the external force. Based on the interface reaction dynamics, KDP aqueous solutions with different concentrations (c_KDP) were applied to replace water in the traditional water-in-oil (W/O) microemulsion. The practicability of the controlled deliquescent mechanism was proved by the decreasing material removal rate (MRR) with the increasing of the c_KDP. As a result, the corrosion pits on the KDP surface were avoided to some degree. Moreover, the roughnesses of KDP with KDP aq/O microemulsion (c_KDP was changed from 10 mM to 100 mM) as polishing solutions were smaller than that with the W/O microemulsion. The smallest surface root-mean-square roughness of 1.5 nm was obtained at a 30 mmol/L KDP aq solution, because of the most appropriate deliquescent rate and MRR.

Ammonia is important, both as a fertilizer and as a carrier of clean energy, mainly produced by the Haber-Bosch process, which consumes hydrogen and emits large amounts of carbon dioxide. The ENRR (Electronchemical Nitrogen Reduction Reaction) is considered a promising method for nitrogen fixation owing to their low energy consumption, green and mild. However, the ammonia yield and Faraday efficiency of the ENRR catalysts are low due to the competitive reaction between HER and NRR, the weak adsorption of N2 andthe strong N≡N triple bond. Oxygen vacancy engineering is the most important method to improve NRR performance, not only for fast electron transport but also for effective breaking of the N≡N bond by capturing metastable electrons in the antibonding orbitals of nitrogen molecules. In this review, the recent progress of OVs (oxygen vacancies) in ENRR has been summarized. First, the mechanism of NRR is briefly introduced, and then the generation methods of OVs and their applicationin NRR are discussed, including vacuum annealing, hydrothermal method, hydrogen reduction, wet chemical reduction, plasma treatment and heterogeneous ion doping. Finally, the development and challenges of OVs in the field of electrochemical nitrogen fixation are presented. This review shows the important areas of development of catalysts to achieve industrially viable NRR.

The cubic Fe3O4 nanoparticles with sharp horns that display the size distribution between 100 and 200 nm are utilized to substitute the magnetic sensitive medium (carbonyl iron powders, CIPs) and abrasives (CeO2/diamond) simultaneously which are widely employed in conventional magnetorheological finishing fluid. The removal rate of this novel fluid is extremely low compared with the value of conventional one even though the spot of the former is much bigger. This surprising phenomenon is generated due to the small size and low saturation magnetization (M s) of Fe3O4 and corresponding weak shear stress under external magnetic field according to material removal rate model of magnetorheological finishing (MRF). Different from conventional D-shaped finishing spot, the low M s also results in a shuttle-like spot because the magnetic controllability is weak and particles in the fringe of spot are loose. The surface texture as well as figure accuracy and PSD1 (power spectrum density) of potassium dihydrogen phosphate (KDP) is greatly improved after MRF, which clearly prove the feasibility of substituting CIP and abrasive with Fe3O4 in our novel MRF design.

Chain-like Co flower is synthesized by simply modulating the reaction conditions via a facile liquid-phase reduction method. The morphology evolution process and transformation mechanism from particle to flower and finally to chain-like flower have been systematically investigated. [001] is the preferred growth orientation due to the existence of easy magnetic axis. The microwave loss mechanism can be attributed to the synergistic effect of magnetic loss and dielectric loss, while magnetic loss is the main loss mechanism. In addition, the special microstructure of chain-like Co flower may further enhance microwave attenuation. The architectural design of functional material morphology is critical for improving its property toward future application.

Although magnetorheological finishing (MRF) is being widely utilized to achieve ultra-smooth optical surfaces, the mechanisms for obtaining such extremely low roughness after the MRF process are not fully understood, especially the impact of finishing stresses. Herein we carefully investigated the relationship between the stresses and surface roughness. Normal stress shows stronger impacts on the surface roughness of fused silica (FS) when compared with the shear stress. In addition, normal stress in the polishing zone was found to be sensitive to the immersion depth of the magnetorheological (MR) fluid. Based on the above, a fine tuning of surface roughness (RMS: 0.22 nm) was obtained. This work fills gaps in understanding about the stresses that influence surface roughness during MRF.