Degradation of silicon rubber due to heat and humidity affect its performance in outdoor applications. To analyze the effects of high temperature and humidity on room temperature vulcanized (RTV) silicone rubber (SiR) and its composites, this study was performed. Five different sample compositions including neat silicone rubber (nSiR), microcomposites (15 wt% silica(SMC 15% SiO₂) and 15 wt% ATH(SMC 15% ATH), nanocomposite (2.5 wt% silica(SNC 2.5% SiO₂) and hybrid composite (10 wt% micro alumina trihydrate with 2 wt% nano silica(SMNC 10% ATH 2% SiO₂) were prepared and subjected to 70 ˚C temperature and 80% relative humidity in an environmental chamber for 120 h. Contact angle, optical microscopy and Fourier transform infrared (FTIR) spectroscopy were employed to analyze the recovery properties before and after applying stresses. Different trends of degradation and recovery were observed for different concentrations of composites. Addition of fillers improved the overall performance of composites and SMC 15% ATH composite performed better than other composites. For high temperature and humidity, the ATH-based microcomposite was recommended over silica due to its superior thermal retardation properties of ATH. It has been proved that ATH filler is able to withstand high temperature and humidity.

The incorporation of inorganic oxide fillers imparts superior dielectric properties in silicone rubber for high-voltage insulation. However, the dielectric characteristics are influenced by the mechanical stress. The effects of ramped compression on the dielectric properties of neat silicone rubber (NSiR), 15% SiO₂ microcomposite (SSMC), 15% alumina trihydrate (ATH) microcomposite (SAMC) and 10% ATH + 2% SiO₂ hybrid composite (SMNC) are presented in this study. The dielectric constant and dissipation factor were measured before and after each compression especially in the frequency range of 50 kHz to 2MHz. Before the compression, SSMC expressed the highest dielectric constant of 4.44 followed by SMNC and SAMC. After the compression cycle, SAMC expressed a better dielectric behavior exhibiting dielectric constant of 7.19 and a dissipation factor of 0.01164. Overall, SAMC expressed better dielectric response before and after compression cycle with dielectric constant and dissipation factor in admissible ranges.

The emergence of micro and nano-based inorganic oxide fillers with optimal filler-loadings further enhances the required insulation characteristics of neat epoxy. During manufacturing and service application, insulators and dielectrics face mechanical stresses which may alter their basic characteristics. Keeping this in mind, the facts’ influence of mechanical stresses and fillers on dielectric properties of polymeric insulators of two epoxy/silica composites were fabricated and thoroughly analyzed for dielectric characteristics under ramped mechanical compressions relative to the unfilled sample. Before compression, epoxy nanocomposites exhibited responses having an average dielectric constant of 7.68 with an average dissipation factor of 0.18. After each compression, dielectric properties of all samples were analyzed. The dissipation factor and the dielectric constant trends of each sample are plotted against a suitable frequency range. It was observed that after the successive compressions up to 25 MPa, the dielectric properties of epoxy micro-silica composites were highly affected, having an average final dielectric constant of 9.65 times that of the uncompressed sample and a dissipation factor of 2.2 times that of the uncompressed sample, and these were recorded.