Degradation of silicon rubber due to heat and humidity affect its performance in outdoor applications. To analyze the effects of high temperature and humidity on room temperature vulcanized (RTV) silicone rubber (SiR) and its composites, this study was performed. Five different sample compositions including neat silicone rubber (nSiR), microcomposites (15 wt% silica(SMC 15% SiO₂) and 15 wt% ATH(SMC 15% ATH), nanocomposite (2.5 wt% silica(SNC 2.5% SiO₂) and hybrid composite (10 wt% micro alumina trihydrate with 2 wt% nano silica(SMNC 10% ATH 2% SiO₂) were prepared and subjected to 70 ˚C temperature and 80% relative humidity in an environmental chamber for 120 h. Contact angle, optical microscopy and Fourier transform infrared (FTIR) spectroscopy were employed to analyze the recovery properties before and after applying stresses. Different trends of degradation and recovery were observed for different concentrations of composites. Addition of fillers improved the overall performance of composites and SMC 15% ATH composite performed better than other composites. For high temperature and humidity, the ATH-based microcomposite was recommended over silica due to its superior thermal retardation properties of ATH. It has been proved that ATH filler is able to withstand high temperature and humidity.

Epoxy resins have demonstrated remarkable properties with potential for usage as high voltage insulators. However, a loss of these properties has been observed in high temperature and humid environments. In order to enhance the hydrothermal stability of epoxy resins, micro (15% SiO₂) and nano (5% SiO₂) silica-based composites of epoxy were fabricated and subjected to standard long term and short term accelerated hydrothermal conditions. To analyze the effect of these stresses, the samples were analyzed periodically through Fourier transform infrared spectroscopy (FTIR) for structure analysis; scanning electron microscopy (SEM) for surface analysis of long-term aged samples; and optical microscopy for the surface topography of short-term aged samples. The Swedish Transmission Research Institute (STRI) classification and contact angle measurement techniques were used for hydrophobicity analysis of long-term and short-term aged samples, respectively. After aging in both conditions, the nanocomposite showed better results as compared to the other samples. After 1000 h of aging, it showed HC-5 class of hydrophobicity, whereas EMC and NE degraded to the HC-6. In case of short-term aging, the contact angle decreased to the 64.15° and 75.05° from 104.15° and 114.9° for ENC and EMC, respectively. Also, in terms of structural degradation, ENC showed the highest structural stability after 1000 h of aging with the highest stable peak of aromatic ether at 1300–1500 cm⁻¹. Microscopic observation through scanning electron and optical techniques also revealed superior performance of the nanocomposites.

The emergence of micro and nano-based inorganic oxide fillers with optimal filler-loadings further enhances the required insulation characteristics of neat epoxy. During manufacturing and service application, insulators and dielectrics face mechanical stresses which may alter their basic characteristics. Keeping this in mind, the facts’ influence of mechanical stresses and fillers on dielectric properties of polymeric insulators of two epoxy/silica composites were fabricated and thoroughly analyzed for dielectric characteristics under ramped mechanical compressions relative to the unfilled sample. Before compression, epoxy nanocomposites exhibited responses having an average dielectric constant of 7.68 with an average dissipation factor of 0.18. After each compression, dielectric properties of all samples were analyzed. The dissipation factor and the dielectric constant trends of each sample are plotted against a suitable frequency range. It was observed that after the successive compressions up to 25 MPa, the dielectric properties of epoxy micro-silica composites were highly affected, having an average final dielectric constant of 9.65 times that of the uncompressed sample and a dissipation factor of 2.2 times that of the uncompressed sample, and these were recorded.