Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (μTP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of μTP technology for realizing the integration of III-V photodiodes and lasers on Si PICs.

We present the current state of the art in micro-transfer printing for heterogeneously integrated silicon photonic integrated circuits. The versatility of the technology is highlighted, as is the way ahead to make this technology a key enabler for next-generation photonic systems-on-chip.

Silicon photonics (SiPh) is a disruptive technology in the field of integrated photonics and has experienced rapid development over the past two decades. Various high-performance Si and Ge/Si-based components have been developed on this platform that allow for complex photonic integrated circuits (PICs) with small footprint. These PICs have found use in a wide range of applications. Nevertheless, some non-native functions are still desired, despite the versatility of Si, to improve the overall performance of Si PICs and at the same time cut the cost of the eventual Si photonic system-on-chip. Heterogeneous integration is verified as an effective solution to address this issue, e.g. through die-wafer-bonding and flip-chip. In this paper, we discuss another technology, micro-transfer printing, for the integration of non-native material films/opto-electronic components on SiPh-based platforms. This technology allows for efficient use of non-native materials and enables the (co-)integration of a wide range of materials/devices on wafer scale in a massively parallel way. In this paper we review some of the recent developments in the integration of non-native optical functions on Si photonic platforms using micro-transfer printing.

An electrically pumped DFB laser integrated on and coupled to a silicon waveguide circuit is demonstrated by transfer printing a 40 × 970 μm² III-V coupon, defined on a III-V epitaxial wafer. A second-order grating defined in the silicon device layer with a period of 477 nm and a duty cycle of 75% was used for realizing single mode emission, while an adiabatic taper structure is used for coupling to the silicon waveguide layer. 18 mA threshold current and a maximum single-sided waveguide-coupled output power above 2 mW is obtained at 20°C. Single mode operation around 1550 nm with > 40 dB side mode suppression ratio (SMSR) is realized. This new integration approach allows for the very efficient use of the III-V material and the massively parallel integration of these coupons on a silicon photonic integrated circuit wafer. It also allows for the intimate integration of III-V opto-electronic components based on different epitaxial layer structures.

Recently, text-guided scalable vector graphics (SVGs) synthesis has shown promise in domains such as iconography and sketch. However, existing text-to-SVG generation methods lack editability and struggle with visual quality and result diversity. To address these limitations, we propose a novel text-guided vector graphics synthesis method called SVGDreamer. SVGDreamer incorporates a semantic-driven image vectorization (SIVE) process that enables the decomposition of synthesis into foreground objects and background, thereby enhancing editability. Specifically, the SIVE process introduces attention-based primitive control and an attention-mask loss function for effective control and manipulation of individual elements. Additionally, we propose a Vectorized Particle-based Score Distillation (VPSD) approach to address issues of shape over-smoothing, color over-saturation, limited diversity, and slow convergence of the existing text-to-SVG generation methods by modeling SVGs as distributions of control points and colors. Furthermore, VPSD leverages a reward model to re-weight vector particles, which improves aesthetic appeal and accelerates convergence. Extensive experiments are conducted to validate the effectiveness of SVGDreamer, demonstrating its superiority over baseline methods in terms of editability, visual quality, and diversity. Project page: https://ximinng.github.io/SVGDreamer-project/

A 4-channel silicon photonics transceiver array for Point-to-Point (P2P) fiber-to-the-home (FTTH) optical networks at the central office (CO) side is demonstrated. A III-V O-band photodetector array was integrated onto the silicon photonic transmitter through transfer printing technology, showing a polarization-independent responsivity of 0.39 - 0.49 A/W in the O-band. The integrated PDs (30 × 40 μm² mesa) have a 3 dB bandwidth of 11.5 GHz at −3 V bias. Together with high-speed C-band silicon ring modulators whose bandwidth is up to 15 GHz, operation of the transceiver array at 10 Gbit/s is demonstrated. The use of transfer printing for the integration of the III-V photodetectors allows for an efficient use of III-V material and enables the scalable integration of III-V devices on silicon photonics wafers, thereby reducing their cost.