Radio-frequency communication systems have long used bulk- and surface-acoustic-wave devices supporting ultrasonic mechanical waves to manipulate and sense signals. These devices have greatly improved our ability to process microwaves by interfacing them to orders-of-magnitude slower and lower-loss mechanical fields. In parallel, long-distance communications have been dominated by low-loss infrared optical photons. As electrical signal processing and transmission approach physical limits imposed by energy dissipation, optical links are now being actively considered for mobile and cloud technologies. Thus there is a strong driver for wavelength-scale mechanical wave or “phononic” circuitry fabricated by scalable semiconductor processes. With the advent of these circuits, new micro- and nanostructures that combine electrical, optical, and mechanical elements have emerged. In these devices, such as optomechanical waveguides and resonators, optical photons and gigahertz phonons are ideally matched to one another, as both have wavelengths on the order of micrometers. The development of phononic circuits has thus emerged as a vibrant field of research pursued for optical signal processing and sensing applications as well as emerging quantum technologies. In this review, we discuss the key physics and figures of merit underpinning this field. We also summarize the state of the art in nanoscale electro- and optomechanical systems with a focus on scalable platforms such as silicon. Finally, we give perspectives on what these new systems may bring and what challenges they face in the coming years. In particular, we believe hybrid electro- and optomechanical devices incorporating highly coherent and compact mechanical elements on a chip have significant untapped potential for electro-optic modulation, quantum microwave-to-optical photon conversion, sensing, and microwave signal processing.

We present the demonstration of an integrated Frequency Modulated Continuous Wave LiDAR on a silicon platform. The waveform calibration, the scanning system and the balanced detectors are implemented on chip. Detection and ranging of a moving hard target at up to 60 m with less than 5 mW of output power is demonstrated here.

Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we discuss a promising technology, micro-transfer-printing (μTP), for the realization of III-V-on-Si PICs. By employing a polydimethylsiloxane elastomeric stamp, the integration of III-V devices can be realized in a massively parallel manner on a wafer without substantial modifications to the SiPh process flow, leading to a significant cost reduction of the resulting III-V-on-Si PICs. This paper summarizes some of the recent developments in the use of μTP technology for realizing the integration of III-V photodiodes and lasers on Si PICs.

Offering open-access silicon photonics-based technologies has played a pivotal role in unleashing this technology from research laboratories to industry. Fabless enterprises rely on the open-access of these technologies for their product development. In the last decade, a diverse set of open-access technologies with medium and high technology readiness levels have emerged. This paper provides a review of the open-access silicon and silicon nitride photonic IC technologies offered by the pilot lines of European research institutes and companies. The paper also highlights upcoming features of these platforms and discusses how they address the long-term market needs.

We show that the structure demonstrated by Feng et al . (Reports, 5 August 2011, p. 729) cannot enable optical isolation because it possesses a symmetric scattering matrix. Moreover, one cannot construct an optical isolator by incorporating this structure into any system as long as the system is linear and time-independent and is described by materials with a scalar dielectric function.

Silicon photonics (SiPh) is a disruptive technology in the field of integrated photonics and has experienced rapid development over the past two decades. Various high-performance Si and Ge/Si-based components have been developed on this platform that allow for complex photonic integrated circuits (PICs) with small footprint. These PICs have found use in a wide range of applications. Nevertheless, some non-native functions are still desired, despite the versatility of Si, to improve the overall performance of Si PICs and at the same time cut the cost of the eventual Si photonic system-on-chip. Heterogeneous integration is verified as an effective solution to address this issue, e.g. through die-wafer-bonding and flip-chip. In this paper, we discuss another technology, micro-transfer printing, for the integration of non-native material films/opto-electronic components on SiPh-based platforms. This technology allows for efficient use of non-native materials and enables the (co-)integration of a wide range of materials/devices on wafer scale in a massively parallel way. In this paper we review some of the recent developments in the integration of non-native optical functions on Si photonic platforms using micro-transfer printing.