As the temperature of electronic devices increases, their failure rate increases. That is why electrical devices should be cooled. One of the promising cooling techniques is using Phase Change Materials (PCMs). A new passive temperature management technique, that involves the direct placement of PCMs on the chip, has been explored and developed. PCMs are potential temperature regulators that can store thermal energy and release it during melting and freezing respectively. PCM-based heat sinks can efficiently store the heat dissipated from the electronic components to delay the peak temperature of the electronic devices as much as possible and then release the stored energy during the off period. This paper compares the temperature distribution on a heat sink with and without PCM with different magnitudes of heat flux. Also, two different PCMs with different densities, namely salt-hydrate and wax, have been investigated in cooling electronic devices.

The temperature of an electronic device is one of the most important parameters to deal with. Any increase above the temperature limits results in a failure in the device. Thus, to ensure good operation, an electronic device should be cooled. One promising technique is the use of Phase Change Materials (PCMs) for their well-known ability to absorb the heat dissipated by the device, thanks to their high latent heat of fusion. Arachidic acid is a fatty acid that, when mixed with sodium decanoate and potassium oleate salts, can be used as a promising PCM due to its high latent heat. This paper aims to shed light on the use such mixtures of Arachidic acid for cooling in a heat sink. An experimental setup was built for this purpose. The results show that the Arachidic acid mixtures are suitable for applications requiring intermediate heat dissipation.