During the thermal sintering of metal nanoparticles (NPs) the process temperature plays the most important role in the outcome of the sintering results and the selection of a suitable substrate. Here, temperature calculation during pulsed laser sintering of silver (Ag) nanoparticles (NPs) inkjet-printed on glass substrates is presented. During the pulsed laser sintering of Ag NPs, a minimum line resistivity less than twice the bulk silver resistivity was obtained within around 52 s under a laser power of 276 mW. The temperature field during the pulsed laser sintering of Ag NPs was estimated via a three-dimensional numerical model in which a temperature-dependent thermal conductivity of Ag NPs was adopted. An algorithm for treating the thermal conductivity of the heated Ag NPs in a region by a previous laser shot was devised for the improvement of the temperature field estimation. A maximum temperature of approximately 204 °C over the Ag NPs line was obtained with a 276 mW laser power and a scanning speed of 135 μm/s.

Owing to its unique properties, silver (Ag) in the form of nanoparticle (NP) ink promises to play a vital role in the development of printed and flexible electronics. Once printed, metal NP inks require a thermal treatment process called sintering to render them conductive. Among the various methods, electrical sintering is a highly selective and rapid sintering method. Here, we studied the electrical sintering of inkjet-printed Ag NP lines via a stepwise current increment sintering (SCIS) technique. In the SCIS technique, the supplied electric current was gradually increased in multiple steps from low electric currents to higher electric currents to avoid thermal damage to the printed Ag NP ink lines. In less than 0.15 s, a line resistivity as low as 6.8 μΩcm was obtained which was comparable with furnace sintered line resistivity of 6.13 μΩcm obtained at 250 °C in 600 s. Furthermore, a numerical model was developed for the SCIS process temperature estimation. The results enabled us to elaborate on the relationship between the Ag NP line resistivity and the process temperature under various electric currents. Under the applied SCIS technique, a stable sintering process was carried out avoiding the conductive ink line and substrate damage.

The influence of nanoparticle (NP) size on the physical characteristics of sintered silver NP ink was studied using four different types of inks. The Ag NP inks were spin-coated on glass substrates with an average thickness of 300 nm. Each sample was sintered for 30 min, with temperatures from 50 °C to 400 °C by an interval of 50 °C. After sintering, the specific resistance of each case was obtained using the resistance and surface profile measurements. The minimum specific resistance obtained by the experiment was 2.6 μΩ·cm in the case in which 50 nm-sized Ag NP ink was sintered at 350 °C. The transformed surface morphology and grain size of each case were observed using scanning electron microscopy and atomic force microscopy. The results of this study can be a reference for future manufacturers in selecting the Ag NP size and the sintering temperature.

We studied the effect of current supply duration at final-step currents during the stepwise electrical sintering of silver (Ag) nanoparticles (NPs). Ag NPs ink was inkjet-printed onto Eagle-XG glass substrates. Constant final-step currents of 0.4 and 0.5 A with various time intervals were applied to the printed samples. The final-step current of 0.5 A damaged the line at a comparatively shorter time duration. On the other hand, the lower final-step current of 0.4 A prevented the line damage at longer time durations while producing comparatively lower Ag NPs specific resistance. The minimum specific resistances of the printed samples sintered at 0.4 and 0.5 A were 3.59 μΩ∙cm and 3.79 μΩ∙cm, respectively. Furthermore, numerical temperature estimation and scanning electron microscope (SEM) analysis were conducted to elaborate on the results. The numerical temperature estimation results implied that the lower estimated peak temperature at the final-step current of 0.4 A helped prevent Ag NP line damage. The SEM micrographs suggested that a high surface porosity—caused by higher sintering peak temperatures—in the case of the 0.5 A final-step current resulted in a comparatively higher Ag NP line-specific resistance. This contribution is a step forward in the development of Ag NP sintering for printed electronics applications.