Polyimides (PIs) represent a benchmark for high-performance polymers on the basis of a remarkable collection of valuable traits and accessible production pathways and therefore have incited serious attention from the ever-demanding medical field. Their characteristics make them suitable for service in hostile environments and purification or sterilization by robust methods, as requested by most biomedical applications. Even if PIs are generally regarded as “biocompatible”, proper analysis and understanding of their biocompatibility and safe use in biological systems deeply needed. This mini-review is designed to encompass some of the most robust available research on the biocompatibility of various commercial or noncommercial PIs and to comprehend their potential in the biomedical area. Therefore, it considers (i) the newest concepts in the field, (ii) the chemical, (iii) physical, or (iv) manufacturing elements of PIs that could affect the subsequent biocompatibility, and, last but not least, (v) in vitro and in vivo biocompatibility assessment and (vi) reachable clinical trials involving defined polyimide structures. The main conclusion is that various PIs have the capacity to accommodate in vivo conditions in which they are able to function for a long time and can be judiciously certified as biocompatible.

Dielectric properties for nanocomposites with metallic fillers inside a polymer matrix were determined using CST STUDIO SUITE—Electromagnetic field simulation software followed by the free-space Nicolson–Ross–Weir procedure. The structure is randomly generated to simulate the intrinsic non-uniformity of real nanomaterials. Cubic insertions were equated to corresponding spherical particles in order to provide either the same volume index or the same exterior surface index. The energy concentration around the inserts and within the entire material was determined as useful information in practice in order to design materials tailored to avoid exceeding the field/temperature limit values. The paper successfully associated the dialectic measurements with the results from the computer simulations, which are mainly based on energetic effects in electromagnetic applications. The experimental results are comparable with the software simulation in terms of precision. The conclusions outline the practical applications of the method for both electromagnetic shielding and microwave domain/telecommunications applications.

This paper describes the simulation of the S (scattering)-parameters and absorbed energy for polymeric nanocomposites with metallic insertions (iron and aluminum, with two particle dimensions). The considered frequency domain, 0.1–3 GHz, is specific for a wide range of applications in microwave technologies. The actual limitations of electromagnetic simulations are described, along with an application related to the Nicolson–Ross–Weir procedure in infinite media, which opens new perspectives in nanocomposite electromagnetic modeling. It was demonstrated that, due to a higher conductivity, nanocomposites with Al particles can absorb a larger amount of energy compared to Fe particles within composite materials, at both insertion dimensions. At higher frequencies, the power loss density increases for both metals. The significant reduction in transmission, linked to a minimal reflection, verifies that for composites with added metallic powder, microwave energy is extensively absorbed by the materials, particularly at frequencies above 1.5 GHz, confirming their potential functionality as hot melts for advanced reversible bonding technologies.

The paper describes the simulation of energy absorption in polymer micro-composites that include dielectric inserts (commercial Al₂O₃ and TiO₂ particles, with three particle sizes of 1, 5 and 25 µm, respectively). The investigated frequency spectrum, mainly from 0.001 to 100 GHz, is designed for various uses as substrates in electronic technologies. The electromagnetic simulation software chosen was CST Studio Suite, which evaluates the power loss at different frequencies, playing a crucial role in creating the ideal structure of these substrates. The effective limits of the electromagnetic simulation are specified. It is shown that a considerable increase in absorption occurs, by a factor of 12 to 120, depending on the dielectric material used for the inserts and the mass ratio applied in the insertion technique. Dielectrics with high permittivity provide higher absorption, but also create a nonuniform field distribution within the material, resulting in a high peak-to-average absorption ratio. In scenarios where this behavior is intolerable, the technology must be carefully tuned to improve the consistency of the insertions in the substrate material. The final outcomes of the simulations indicated that for creating new substrates for flexible electronics, polyethylene composites with TiO₂ insertions are suggested, particularly at lower concentrations of up to 7% and with a larger radius, such as 25 μm, which could offer significant economic advantages considering that the current concept advises the use of costly particles ranging from nanoscale particles to those 1 μm in size and a composition exceeding 10%.

Polyolefin bonding technologies with metal foils are extensively employed in various sectors, particularly in automotive, electronics, and aerospace industries. This research examined the innovative electromagnetic joining of polyolefins to aluminum by evaluating the behavior of hot-melt adhesives derived from polyolefins containing metallic particles. The study aimed at establishing the specific absorption rate (SAR, expressed in W/kg) via electromagnetic simulation using CST Studio Suite software. It was observed that, regardless of particle size, Al was the most efficient particle, while the distribution of particles has a negligible impact on Total SAR values. The most significant beneficial effect of the inserts on the absorption capacity of the hot-melt material is primarily observed with a particle size of 1 μm. When connecting polyolefins to aluminum, the power loss density and SAR values exceed those for bonding polyolefins to polyolefins by at least 10 times, owing to aluminum’s conductive properties, which influence the absorption of additional energy in the hot melt mass, likely due to the Salisbury screen effect generated by the bonding arrangement. For hot melts made from polyethylene, a higher frequency of 5.8 GHz is suggested, which is a newly approved frequency used in advanced industrial applications. This positively impacts the effectiveness and viability of the bonding process of polyolefins to aluminum, resulting in reduced exposure times and/or decreased microwave exposure power. It was observed that the hot melts derived from HDPE and PP yielded greater SAR values. Conversely, the SAR values increase when aluminum is attached to HDPE. As a result, the strongest bond of polyolefins to Al occurs when connecting HDPE to Al using HDPE-based hot melts. The proposed simulation methodology may offer considerable improvement in evaluating the efficacy of bonding technology for dissimilar materials subjected to electromagnetic energy