Zahabul Islam

Dr. Zahabul Islam

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Research Focus & Metrics

Academic Career Length

14Years (2013-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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1 April 2019 in Journal of Materials Science & Technology
Verified
Journal Article
Closed access
DWDaudi Waryoba
Daudi Waryoba
Zahabul IslamZahabul Islam
Zahabul Islam
BWBaoming Wang
Baoming Wang
AHAman Haque
Aman Haque

1 November 2019 in Microelectronics Reliability
Verified
Journal Article
Closed access
Zahabul IslamZahabul Islam
Zahabul Islam
APAngela L. Paoletta
Angela L. Paoletta
AMAnthony M. Monterrosa
Anthony M. Monterrosa
JSJennifer D. Schuler
Jennifer D. Schuler
TRTimothy J. Rupert
Timothy J. Rupert
AHAman Haque
Aman Haque

1 November 2013 in Computational Materials Science
Verified
Journal Article
Closed access
MMMonon Mahboob
Monon Mahboob
Zahabul IslamZahabul Islam
Zahabul Islam

13 November 2021 in Metallurgical and Materials Transactions A
Verified
Journal Article
Closed access
PDF file
Zahabul IslamZahabul Islam
Zahabul Islam
AAAnkur Kumar Agrawal
Ankur Kumar Agrawal
BRBehzad Rankouhi
Behzad Rankouhi
CMCollin Magnin
Collin Magnin
MAMark H. Anderson
Mark H. Anderson
DTDan J. Thoma
Dan J. Thoma

1 April 2020 in Journal of Alloys and Compounds
Verified
Journal Article
Closed access
DWDaudi Waryoba
Daudi Waryoba
Zahabul IslamZahabul Islam
Zahabul Islam
BWBaoming Wang
Baoming Wang
AHAman Haque
Aman Haque

19 June 2020 in IEEE Transactions on Electron Devices
Verified
Journal Article
Closed access
Zahabul IslamZahabul Islam
Zahabul Islam
MXMinghan Xian
Minghan Xian
AHAman Haque
Aman Haque
FRFan Ren
Fan Ren
Marko Jak TadjerMarko Jak Tadjer
Marko Jak Tadjer
SPStephen Pearton
Stephen Pearton
In this article, we investigate defect nucleation leading to device degradation in $\beta $ -Ga 2 O 3 Schottky barrier diodes by operating them inside a transmission electron microscope. Such in situ approach allows simultaneous visualization and quantitative device characterization, not possible with the current art of postmortem microscopy. High current density and associated mechanical and thermal fields are shown to induce different types of crystal defects, from vacancy cluster and stacking fault to microcrack generation prior to failure. These structural defects can act as traps for carrier and cause device failure at high biasing voltage. Fundamental insights on nucleation of these defects and their evolution are important from materials reliability and device design perspectives.