received the bachelor's degree in Microelectronics Science and Engineering from the Xiamen University, Xiamen, China, in 2017. He is currently pursuing a Ph.D major in MEMS at School of Electronic and Computer Engineering, Shenzhen Graduate School of Peking University, Shenzhen, China. Since June 2022, he has been conducting cooperative scientific research work in Wuxi BEWIS Sensing Technology LLC, with the direction of system-in-package design and simulation. His main research interests are the analysis of the electrical characteristics of TSVs in 3D integration, the design and optimization of power supply networks for silicon interposers, the defect detection of TSVs, and the design and simulation of system-in-package packages. He is also interested in the research of MEMS sensors and RF silicon interposers.