Prof. Mingxiang Chen

In this work, we proposed a chip on thermoelectric cooler (chip-on-TEC) for the active thermal management of high-power light-emitting diode (LED). The chip-on-TEC was prepared by electroplating a circuit layer on the cold-side substrate of thermoelectric cooling (TEC) and directly attaching LED chips on the circuit layer. Due to the Peltier effect of TE materials and the low thermal resistance of chip-on-TEC structure, the heat generated from the chips can be dissipated to the surrounding environment effectively. The performances of chip-on-TEC were studied by using the thermal simulation and packaging experiment. Compared with the traditional packaging structure, the working temperature of chip-on-TEC is greatly reduced under various chip currents. At the chip current of 1.0 A, the chip-on-TEC can reduce the working temperature from 232 °C to 114 °C (the reduction of 51%). Moreover, the light output power of LED is increased by 35.3%. The chip-on-TEC also can improve the light intensity and the light saturation point of LED. The results demonstrate that the chip-on-TEC is a promising thermal management for high-power LED packaging.

About Me

Zhao Heran Male, born in 1986, Senior Engineer, Ph.D. Candidate. Expert at China Electronics Technology Group Corporation. Executive Deputy Director of the Liaoning Provincial Key Laboratory of Flexible Electronics & Micro-Nano Integrated Systems. Focus on electronic packaging and reliability. Led or participated in over 20 national-level projects; presided over or participated in 5 national standard projects for flexible electronics. Published over 20 papers and authored 3 monographs. Cao Lihua Female, Associate Research Fellow. Employed at the Institute of Metal Research, Chinese Academy of Sciences. Primary research area: Metallic interconnect materials and reliability. Chen Mingxiang Male, Professor and PhD Supervisor at the School of Mechanical Science and Engineering, Huazhong University of Science and Technology (HUST). Primary research focus: Advanced electronic packaging and micro/nano manufacturing. Led research projects including the National Natural Science Foundation of China and National Key R&D Program. Published over 80 academic papers. Zhang He Female, born in 1989, Senior Engineer. Employed at the 13th Research Institute, China Electronics Technology Group Corporation. Primary research directions: Ceramic thin-film passive IPD, DPC packaging processes, and organic packaging substrate technologies. Wang Shizhao Male, Professor at Hainan University. Primary research focus: Advanced 3D integration technologies.

Prof. Mingxiang Chen

Prof. Mingxiang Chen

Research Focus & Metrics

Academic Career Length

Publication Type Breakdown

Representative Publications

About Me