On-chip integrated mode-division multiplexing (MDM) is an emerging technique for large-capacity data communications. In the past few years, while several configurations have been developed to realize on-chip MDM circuits, their practical applications are significantly hindered by the large footprint and inter-mode cross talk. Most importantly, the high-speed MDM signal transmission in an arbitrarily routed circuit is still absent. Herein, we demonstrate the MDM circuits based on digitized meta-structures which have extremely compact footprints. 112 Gbit/s signals encoded on each mode are arbitrarily routed through the circuits consisting of many sharp bends and compact crossings with a bit error rate under forward error correction limit. This will significantly improve the integration density and benefit various on-chip multimode optical systems.
Recently, 2-μm wave band has gained increasing interest due to its potential application for next-generation optical communication. But the development of 2-μm optical communications is substantially hampered by the modulation speed due to the device bandwidth constraints. Thus, a high-speed modulator is highly demanded at 2 μm. Motivated by this prospect, we demonstrate a high-speed silicon Mach–Zehnder modulator for a 2-μm wave band. The device is configured as a single-ended push–pull structure with waveguide electrorefraction via the free carrier plasma effect. The modulator was fabricated via a multiproject wafer shuttle run at a commercial silicon photonic foundry. The modulation efficiency of a single arm is measured to be . The high-speed characterization is also performed, and the modulation speed can reach 80 Gbit/s with 4-level pulse amplitude modulation (PAM-4) formats.
Hollow-core fiber (HCF) has been attracting broad interests in recent decades, and has extended the communication window to longer wavelength, 2 micron. In this paper, we present a demonstration of low-latency HCF short-reach optical interconnection at 2 micron, achieving a high single-lane speed of 100 Gbps. High physical speed (near vacuum-light-speed) and high information speed (100-Gbps) optical interconnection with 100-m transmission distance is experimentally achieved with error-free performance. Probabilistically shaped discrete multi-tone (PS-DMT) modulation with entropy loading is employed to accommodate the deteriorated frequency response caused by the mode dispersion in HCF. Compared with conventional solid-core fiber (SCF), HCF contributes 30.95% (1.5-'s per kilometer) latency reduction for the physical link. The system level latency reduction is 28% for 1-km interconnection distance (11% for 100-m), with respect to a microsecond-scale switching network for typical datacenter applications. This work substantially leaps over the 100G milestone of 2-micron HCF optical interconnection, and shows the potentiality with lower latency and further higher capacity.
Recently, significantly raised interests have emerged for the 2 µm waveband as an extended new window for fiber optic communication. Much research progress has been made on the photonic integrated circuits for the 2 µm waveband, especially on the CMOS-compatible silicon-on-insulator wafer. In this work, a silicon integrated microring modulator (MRM) with record high-speed performances at the 2 µm waveband was demonstrated. An L-shaped PN junction was specially designed for 2 µm to achieve a high modulation efficiency with of . The measured 3 dB bandwidth is 18 GHz, supporting up to 50 Gbps signaling at 2 µm. Additionally, optical bistability induced by the thermo-optical effect and nonlinear effects was analyzed theoretically and observed experimentally in the 2 µm MRM for the first time to our knowledge. Nonlinear coupled mode theory and the Runge–Kutta method were used to simulate the behaviors of bistability in the 2 µm MRM. The simulation and experimental results indicate that, when the MRM is launched by a high optical power, the distorted resonant spectrum under an optical bistable state deteriorates the modulation efficiency and signal performances. This work breaks the record of high-speed silicon MRM at 2 µm, drawing a promising prospect for the silicon photonic integration and high-speed interconnection at the 2 µm waveband, and it provides the referenceable analysis of optical bistability, which guides the design and experimental investigation of 2 µm MRM.
Few-mode fiber (FMF) supporting many modes with weak-coupling is highly desired in mode division multiplexing (MDM) systems. The multi-parameter design of FMF becomes comparably difficult, inaccurate and time-consuming when it comes for complex fiber structures and many high order modes. In this work, we demonstrate a machine learning method using neural network to inversely design the desired FMF based on multiple-ring structure. By using the minimum index difference between adjacent modes as the weak-coupling optimization aim, we realize the inverse design of 4-ring step-index FMFs for supporting 4, 6 and 10 -mode operation, and 6-ring step-index FMF for supporting 20-mode operation. This method provides high-accuracy, high-efficiency and low-complexity for fast and reusable design of optical fibers, including particularly weak-coupling FMF in this work. It can be widely extended to a lot of fibers and has great potential for instantaneous applications in the optical fiber industry.
In this work, a silicon-integrated edge coupler supporting dual-mode fiber-to-chip coupling was designed and fabricated on 220-nm-thick SOI wafer with standard CMOS-compatible fabrication process. The proposed low-complexity structure consists of a multimode interference and triple-tip inverse taper. Both LP01 and LP11 modes in the few mode fiber (FMF) can be stimulated simultaneously by the edge coupler from TE0 and TE1 modes in silicon waveguide. Such a design is compatible with broadband wavelength division multiplexing and can be scaled up to 4-polarization-mode coupling as well. Using the proposed edge coupler, 2×100-Gbps/lambda PAM4 multimode interface through dual-mode fiber was demonstrated successfully.