Voronoi tessellations are shown to be statistically representative of polycrystalline microstructures, which have been widely accepted for the modeling of microstructures of metallurgic and ceramic materials. In this paper, a new implementation of the Voronoi diagram in Laguerre geometry is presented for the generation of numerical models of polycrystalline microstructures, where the size and shape of the grains can be controlled, and the 3D grain boundaries can be modeled with a specified thickness. The distribution of grain sizes in the models is fitted to a lognormal distribution, compared with the normal distribution in the Voronoi tessellation methods. Finally, statistical analyses of grain face and grain size distribution are performed with the models, and the macroscopic elastic properties of polycrystalline ceramic materials are simulated to verify the capability of the presented method.

A through-mask electrochemical micromachining process with a foamed cathode (foamed-cathode through-mask electrochemical micromachining (TMEMM)) has recently been proposed involving micro-scale surface microstructures with a high geometric consistency that are fabricated on the curved-surface workpiece. In this paper, to make the foamed-cathode TMEMM process more cost-efficient in the applications, significant modifications are made to this process and an upgraded version of the foamed-cathode TMEMM process is developed. In this modified process, the sandwich-like unit (including the foamed cathode, mask, and workpiece) is closely assembled by the magnetic field force instead of the conventionally-used mechanical force and is kept moving up-and-down inside the electrolyte, avoiding the use of the traditional pump-driven circulation for the electrode process. Experiments are carried out to evaluate the machining effect of this modified TMEMM for fabricating micro-dimples. The research results verify that this modified TMEMM process can produce highly uniform micro-dimples whose minimum CV (coefficient of variation) values in depth and in diameter are 5.4% and 1.9%, respectively, with smooth surfaces of the minimum Ra being 0.21–0.35 µm. These values are smaller than those previously reported. This results in the positive effects on the mass transfer driven by magnetohydrodynamic convection induced by the magnetic field within the interelectrode and the foamed electrode.

High aspect ratio (HAR) ultrafine tapered holes (diameter ≤5 μm; AR ≥5) are the most important elements for some high-tech perforated metallic products, but they are very difficult to manufacture. Therefore, this paper proposes a nontraditional over-growth electroforming process. The formation mechanism of the HAR ultrafine tapered holes is investigated, and the factors controlling the geometric shape evolution are analyzed numerically. It was found that the geometric shape and dimensions of the holes are highly dependent on the diameter and thickness of the photoresist film patterns, but are hardly affected by the spacing between two neighboring patterns; the achievable diameter for a given hole depth becomes small with the increasing pattern diameter, but it becomes big with the increasing pattern thickness. These correlations can be well interpreted by the established two empirical equations that characterize the relationship between the minimum orifice of the tapered hole and the structural parameters of the photoresist film patterns previously formed on the substrate. Application of the fabricated 1500 tapered holes with 3-μm diameter and 17-AR as the nozzles of the medical precision nebulizer is also examined. The studies show that the over-growth electroforming process is highly applicable in fabricating the perforated metallic plate with HAR ultrafine tapered holes.

The efficient and cost-effective preparation of masks has always been a challenging issue in mask-based electrochemical machining. In this paper, an electrochemical machining process of micro-textures is proposed using hard particle masks such as titanium and zirconia particles. Numerical simulations were conducted to analyze the formation mechanisms of micro-protrusion structures with insulating and conductive hard particle masks, followed by experimental verification of the process. The results indicate that when the hard particles are electrically insulating, metal material preferentially dissolves at the center of the particle gap, and the dissolution then expands over time in depth and towards the particle contact points. Conversely, using the conductive particles as the masks, such as titanium particles, dissolution initially occurs in a ring region centered at the contact point between the hard particle and the anode, with a radius approximately one-quarter of the chosen particle’s diameter (200 μm), and then continues to expand outward.