The pursuit of sub‐1‐nm field‐effect transistor (FET) channels within 3D semiconducting crystals faces challenges due to diminished gate electrostatics and increased charge carrier scattering. 2D semiconductors, exemplified by transition metal dichalcogenides, provide a promising alternative. However, the non‐idealities, such as excess low‐frequency noise (LFN) in 2D FETs, present substantial hurdles to their realization and commercialization. In this study, ideal LFN characteristics in monolayer MoS₂ FETs are attained by engineering the metal‐2D semiconductor contact and the subgap density of states (DOS). By probing non‐ideal contact resistance effects using CuS and Au electrodes, it is uncovered that excess contact noise in the high drain current (I_D) region can be substantially reduced by forming a van der Waals junction with CuS electrodes. Furthermore, thermal annealing effectively mitigates sulfur vacancy‐induced subgap density of states (DOS), diminishing excess noise in the low I_D region. Through meticulous optimization of metal‐2D semiconductor contacts and subgap DOS, alignment of 1/f noise with the pure carrier number fluctuation model is achieved, ultimately achieving the sought‐after ideal LFN behavior in monolayer MoS₂ FETs. This study underscores the necessity of refining excess noise, heralding improved performance and reliability of 2D electronic devices.