Electronic circuits provide us with the ability to control the transport and storage of electrons. However, the performance of electronic circuits is now becoming rather limited when digital information needs to be sent from one point to another. Photonics offers an effective solution to this problem by implementing optical communication systems based on optical fibers and photonic circuits. Unfortunately, the micrometer-scale bulky components of photonics have limited the integration of these components into electronic chips, which are now measured in nanometers. Surface plasmon–based circuits, which merge electronics and photonics at the nanoscale, may offer a solution to this size-compatibility problem. Here we review the current status and future prospects of plasmonics in various applications including plasmonic chips, light generation, and nanolithography.

Achieving broadband absorption has been a topic of intensive research over the last decade. However, the costly and time consuming stage of lithography has always been a barrier for the large-area and mass production of absorbers. In this work, we designed, fabricated, and characterized a lithography-free, large-area compatible, omni-directional, ultra-broadband absorber that consists of the simplest geometrical configuration for absorbers: Metal-Insulator-Metal (MIM). We introduced and utilized Manganese (Mn) for the first time as a very promising metal for broadband absorption applications. We optimized the structure step-by-step and compared Mn against the other best candidates introduced so far in broadband absorption structures and showed the better performance of Mn compared to them. It also has the advantage of being cheaper compared to metals like gold that has been utilized in many patterned broadband absorbers. We also presented the circuit model of the structure. We experimentally achieved over 94 percent average absorption in the range of 400–900 nm (visible and above) and we obtained absorption as high as 99.6 percent at the wavelength of 626.4 nm. We also experimentally demonstrated that this structure retains broadband absorption for large angles up to 70 degrees.

In this paper, we propose a methodology to maximize the absorption bandwidth of a metal-insulator-metal (MIM) based absorber. The proposed structure is made of a $\mathrm{Cr}\text{-}{\mathrm{Al}}_2{\mathrm{O}}_3\text{-}\mathrm{Cr}$ multilayer design. At the initial step, the optimum MIM planar design is fabricated and optically characterized. The results show absorption above 0.9 from 400 nm to 850 nm. Afterward, the transfer matrix method is used to find the optimal condition for the perfect light absorption in an ultra-broadband frequency range. This modeling approach predicts that changing the filling fraction of the top Cr layer can extend light absorption toward longer wavelengths. We experimentally proved that the use of proper top Cr thickness and annealing temperature leads to a nearly perfect light absorption from 400 nm to 1150 nm, which is much broader than that of a planar design. Therefore, while keeping the overall process lithography-free, the absorption functionality of the design can be significantly improved. The results presented here can serve as a beacon for future performance-enhanced multilayer designs where a simple fabrication step can boost the overall device response without changing its overall thickness and fabrication simplicity.

In this work, we propose an optimum unit cell arrangement to obtain near absolute polarization insensitivity in a metal-insulator-metal (MIM) based ultra-broadband perfect absorber. Our findings prove that upon utilizing this optimum arrangement, the response of the absorber is retained and unchanged over all arbitrary incidence light polarizations, regardless of the shape of the top metal patch. First, the impact of the geometry of the top nanopatch resonators on the absorption bandwidth of the overall structure is explored. Then, the response of the MIM design for different incidence polarizations and angles is scrutinized. Finally, the proposed design is fabricated and characterized.