Despite great progress in four-dimensional (4D) printing, i.e. three-dimensional (3D) printing of active (stimuli-responsive) materials, the relatively low actuation force of the 4D printed structures often impedes their engineering applications. In this study, we use multimaterial inkjet 3D printing technology to fabricate shape memory structures, including a morphing wing flap and a deployable structure, which consist of active and flexible hinges joining rigid (non-active) parts. The active hinges, printed from a shape memory polymer (SMP), lock the structure into a second temporary shape during a thermomechanical programming process, while the flexible hinges, printed from an elastomer, effectively increase the actuation force and the load-bearing capacity of the printed structure as reflected in the recovery ratio. A broad range of mechanical properties such as modulus and failure strain can be achieved for both active and flexible hinges by varying the composition of the two base materials, i.e. the SMP and the elastomer, to accommodate large deformation induced during programming step, and enhance the recovery in the actuating step. To find the important design parameters, including local deformation, shape fixity and recovery ratio, we conduct high fidelity finite element simulations, which are able to accurately predict the nonlinear deformation of the printed structures. In addition, a coupled thermal-electrical finite element analysis was performed to model the heat transfer within the active hinges during the localized Joule heating process. The model predictions showed good agreement with the measured temperature data and were used to find the major parameters affecting temperature distribution including the applied voltage and the convection rate.

Microelectronic packages are typically composed of different layers of materials with un-similar thermo-mechanical properties. Fabrication-induced residual stresses, resulting from the mismatch of layers’ thermo-mechanical properties, may lead to adverse effects such as warpage and delamination at the interface of layers. In this study, the fabrication process of the ball grid array (BGA) package was simulated to predict the thermal residual stresses through the thickness of the package. A finite-element model incorporating realistic material behavior of the BGA package layers was developed. To this end, the epoxy molding compound (EMC) was modeled as a viscoelastic material, while the silicon chip, the die-attach, and the composite substrate were simulated using an elastic model during cooling. Since Young’s modulus of EMC is time and temperature-dependent, three different process temperatures were simulated to investigate the impact of viscoelastic properties of EMC, defined using Prony coefficients, on numerical residual stresses. To verify the simulation results, the incremental hole-drilling method was used to experimentally measure the residual stress components. It includes drilling a small hole at the center of a rosette strain gauge bonded on the BGA package surface and measuring the released strains on the surface. The relaxed strains were then converted to the residual stresses using a calibration matrix whose coefficients are determined from a finite-element model. The reasonable agreement of numerical and experimental components of the residual stress throughout the thickness of the BGA package confirms the reliability of the proposed simulation approach in estimating residual stresses in microelectronics packages.

Additive manufacturing (AM) of large-scale polymer and composite parts using robotic arms integrated with extruders has received significant attention in recent years. Despite the contributions of great technical progress and material development towards optimizing this manufacturing method, different failure modes observed in the final printed products have hindered its application in producing large engineering structures used in aerospace and automotive industries. We report failure modes in a variety of printed polymer and composite parts, including fuel tanks and car bumpers. Delamination and warpage observed in these parts originate mostly from thermal gradients and residual stresses accumulated during material deposition and cooling. Because printing large structures requires expensive resources, process simulation to recognize the possible failure modes can significantly lower the manufacturing cost. In this regard, accurate prediction of temperature distribution using thermal simulations is the first step. Finite element analysis (FEA) was used for process simulation of large-scale robotic AM. The important steps of the simulation are presented, and the challenges related to the modeling are recognized and discussed in detail. The numerical results showed reasonable agreement with the temperature data measured by an infrared camera. While in small-scale extrusion AM, the cooling time to the glassy state is less than 1 s, in large-scale AM, the cooling time is around two orders of magnitudes longer.

Compared with silicon-based power devices, wide band gap (WBG) semiconductor devices operate at significantly higher power densities required in applications such as electric vehicles and more electric airplanes. This necessitates development of power electronics packages with enhanced thermal characteristics that fulfil the electrical insulation requirements. The present research investigates the feasibility of using ceramic additive manufacturing (AM), also known as three-dimensional (3D) printing, to address thermal and electrical requirements in packaging gallium nitride (GaN) based high-electron-mobility transistors (HEMTs). The goal is to exploit design freedom and manufacturing flexibility provided by ceramic AM to fabricate power device packages with a lower junction-to-ambient thermal resistance ( R _θJA ). Ceramic AM also enables incorporation of intricate 3D features into the package structure in order to control the isolation distance between the package source and drain contact pads. Moreover, AM allows to fabricate different parts of the packaging assembly as a single structure to avoid high thermal resistance interfaces. For example, the ceramic package and the ceramic heatsink can be printed as a single part without any bonding layer. Thermal simulations under different thermal loading and cooling conditions show the improvement of thermal performance of the package fabricated by ceramic AM. If assisted by an efficient cooling strategy, the proposed package has the potential to reduce R _θJA by up to 48%. The results of the preliminary efforts to fabricate the ceramic package by AM are presented, and the challenges that have to be overcome for further development of this manufacturing method are recognized and discussed.

In this paper, the stamp forming process of a U-shaped cross-section channel with sharp corners of composite laminates including aluminum sheet and polyvinyl chloride (PVC) reinforced with 3D-fiberglass was investigated. The laminates were produced by manual layup and arrangement of fibers with different angles of [0°/90°] and [± 45°] degrees using hot press. The process of forming composite samples was carried out at temperatures of 25, 80, 120, 160°C and different velocities of punch. The effect of parameters including layup configuration, temperature, and forming speed on the spring-back of the formed laminates and the required forming force were evaluated. The results showed that as the forming temperature increased, the forming force decreased sharply. The lowest forming force was obtained for the laminate with [± 45°, Al, ± 45°] layout at 160°C temperature which was equal to 0.7KN. Also, with the increase in temperature, the spring-back angle has been reduced, the lowest of which is obtained with the laminate with [0°/90°] ₃ layout equal to 8 degrees. Finally, it was concluded that increasing the speed of the forming process results in a decrease in the spring-back angle and this effect is more pronounced at higher temperatures. Graphical abstract

High-density electronics packaging requires fabrication of intricate conductive and dielectric features within a dense three-dimensional structure. Simultaneous deposition of both conductive and insulative printing materials using multimaterial additive manufacturing (AM) provides new opportunities to fabricate electronics packages with complex designs. This article reports the first demonstration of fully printed power die-embedded electronics package for wide band-gap devices. For this purpose, multimaterial inkjet AM was used to print a 0.5-mm thick electronics package for gallium nitride (GaN) power chips. The conductive parts of the package, including traces and vias, were printed using a high electrical conductivity silver ink, while a polyimide ink was used to print dielectric parts. The electrical characterization tests showed the reasonable performance of the printed package. While the conventional embedded packaging includes many steps such as laminating, plating, and drilling, which creates significant material waste and environmental issues, the proposed AM approach is done in a single step without material waste.