This treatise studies a microoptoelectromechanical accelerometer (MOEMA) with an optical measuring transducer built according to the optical tunneling principle (evanescent coupling). The work discusses the design of the accelerometer’s microelectromechanical sensing element (MSE) and states the requirements for the design to achieve a sensitivity threshold of 1 µg m/s² at a calculated eigenvalue of the MSE. The studies cover the selection of the dimensions, mass, eigenfrequency and corresponding stiffness of the spring suspension, gravity-induced cross-displacements. The authors propose and experimentally test an optical transducer positioning system represented by a capacitive actuator. This approach allows avoiding the restrictions in the fabrication of the transducer conditioned by the extremely high aspect ratio of deep silicon etching (more than 100). The designed MOEMA is tested on three manufactured prototypes. The experiments show that the sensitivity threshold of the accelerometers is 2 µg. For the dynamic range from minus 0.01 g to plus 0.01 g, the average nonlinearity of the accelerometers’ characteristics ranges from 0.7% to 1.62%. For the maximum dynamic range from minus 0.015 g to plus 0.05 g, the nonlinearity ranges from 2.34% to 2.9%, having the maximum deviation at the edges of the regions. The power gain of the three prototypes of accelerometers varies from 12.321 mW/g to 26.472 mW/g. The results provide broad prospects for the application of the proposed solutions in integrated inertial devices.

Purpose: Technological capabilities of manufacturing microelectromechanical system (MEMS) gyroscopes are still insufficient if compared to manufacturing high-efficient gyroscopes and accelerometers. This creates weaknesses in their mechanical structure and restrictions in the measurement accuracy, stability and reliability of MEMS gyroscopes and accelerometers. This paper aims to develop a new architectural solutions for optimization of MEMS gyroscopes and accelerometers and propose a multi-axis MEMS inertial module combining the functions of gyroscope and accelerometer. Design/methodology/approach: The finite element modeling (FEM) and the modal analysis in FEM are used for sensing, drive and control electrode capacitances of the multi-axis MEMS inertial module with the proposed new architecture. The description is given to its step-by-step process of manufacturing. Algorithms are developed to detect its angular rates and linear acceleration along three Cartesian axes. Findings: Experimental results are obtained for eigenfrequencies and capacitances of sensing, drive and control electrodes for 50 manufactured prototypes of the silicon electromechanical sensor (SES). For 42 SES prototypes, a good match is observed between the calculated and simulated capacitance values of comb electrodes. Thus, the mean-square deviation is not over 20 per cent. The maximum difference between the calculated and simulated eigenfrequencies in the drive channel of 11 SES prototypes is not over 3 per cent. The same difference is detected for eigenfrequencies in the first sensing channel of 17 SES prototypes. Originality/value: This study shows a way to design and optimize the structure and theoretical background for the development of the MEMS inertial module combining the functions of gyroscope and accelerometer. The obtained results will improve and expand the manufacturing technology of MEMS gyroscopes and accelerometers.

This paper presents the design and simulation of a microelectromechanical gyroscope that simultaneously determines two components of angular velocity. In this device, the silicon sensor is started by an electrostatic actuator to perform a linear harmonic motion at a controlled speed. The movable masses of the sensor move in two directions, orthogonal to the primary vibrations of the sensor under the action of Coriolis forces. This paper considers how temperature influences eigenfrequencies and informative vibrational magnitudes of the micromechanical angular velocity sensor. The parameters that have the greatest impact on the sensor output behavior are determined by a finite-element analysis method. Techniques to stabilize vibration eigenfrequencies of the sensing element are suggested.

Micro-opto-electro-mechanical (MOEM) accelerometers that can measure small accelerations are attracting growing attention thanks to their considerable advantages—such as high sensitivity and immunity to electromagnetic noise—over their rivals. In this treatise, we analyze 12 schemes of MOEM-accelerometers, which include a spring mass and a tunneling-effect-based optical sensing system containing an optical directional coupler consisting of a fixed and a movable waveguide separated by an air gap. The movable waveguide can perform linear and angular movement. In addition, the waveguides can lie in single or different planes. Under acceleration, the schemes feature the following changes to the optical system: gap, coupling length, overlapping area between the movable and fixed waveguides. The schemes with altering coupling lengths feature the lowest sensitivity, yet possess a virtually unlimited dynamic range, which makes them comparable to capacitive transducers. The sensitivity of the scheme depends on the coupling length and amounts to 11.25 × 10³ m⁻¹ for a coupling length of 44 μm and 30 × 10³ m⁻¹ for a coupling length of 15 μm. The schemes with changing overlapping areas possess moderate sensitivity (1.25 × 10⁶ m⁻¹). The highest sensitivity (above 6.25 × 10⁶ m⁻¹) belongs to the schemes with an altering gap between the waveguides.

The paper presents the effect of mechanical impact on the multiple-axis microelectromechanical system (MEMS) accelerometer. The parameters of accelerometer and its impact load allow considering the impact to be long and displacements induced by this impact to be quasi-static. The impact load results in a contact interaction between the movable and stationary elements of the structure. To prevent the contact interaction, the limit stops are installed in accelerometer. Investigations are carried out using the ANSYS finite element program and MATLAB/Simulink support package. Investigation results are achieved for the displacement and stress values of accelerometer.