Wide bandgap (WBG) semiconductors such as gallium nitride (GaN) and silicon carbide (SiC) have revolutionized modern power electronics by enabling devices that operate at higher voltages, temperatures, and switching frequencies than their silicon counterparts. This paper reviews the material properties, device architectures, fabrication techniques, and thermal management strategies that underpin the performance of GaN and SiC technologies. We highlight key trade-offs between GaN and SiC in terms of voltage blocking capability, switching efficiency, and thermal robustness and discussed their application in electric vehicles, renewable energy systems, and power converters. Market adoption trends and manufacturing challenges are also analyzed, with attention to cost-performance dynamics and packaging innovations. Finally, we address the critical role of thermal boundary resistance and emerging reliability solutions, providing a perspective on the future trajectory of WBG device research and commercialization.

The electrical and structural properties of two levels (E90 and H180) in diluted n- and p-type Si_1 − xGe_x alloys (0 ≤ x ≤ 0.070) are investigated by high-resolution Laplace deep level transient spectroscopy measurements and first-principles calculations. By exploiting the presence of Ge atoms close to a substitutional C atom, we show that E90 and H180 belong to the same C–H pair (labeled CH_1BC) with H in a bond-centered configuration (C—H_BC—Si). The relative energies of the various configurations of the CH pair are calculated, and the complete vibrational spectra in the lowest-energy structures for each charge state are predicted.