Metallic nanowires are known to break into shorter fragments due to the Rayleigh instability mechanism. This process is strongly accelerated at elevated temperatures and can completely hinder the functioning of nanowire-based devices like e.g. transparent conductive and flexible coatings. At the same time, arranged gold nanodots have important applications in electrochemical sensors. In this paper we perform a series of annealing experiments of gold and silver nanowires and nanowire junctions at fixed temperatures 473, 673, 873 and 973 K (200 °C, 400 °C, 600 °C and 700 °C) during a time period of 10 min. We show that nanowires are especially prone to fragmentation around junctions and crossing points even at comparatively low temperatures. The fragmentation process is highly temperature dependent and the junction region breaks up at a lower temperature than a single nanowire. We develop a gold parametrization for kinetic Monte Carlo simulations and demonstrate the surface diffusion origin of the nanowire junction fragmentation. We show that nanowire fragmentation starts at the junctions with high reliability and propose that aligning nanowires in a regular grid could be used as a technique for fabricating arrays of nanodots.

In this work polyhedron-like gold and sphere-like silver nanoparticles (NPs) were manipulated on an oxidized Si substrate to study the dependence of the static friction and the contact area on the particle geometry. Measurements were performed inside a scanning electron microscope (SEM) that was equipped with a high-precision XYZ-nanomanipulator. To register the occurring forces a quartz tuning fork (QTF) with a glued sharp probe was used. Contact areas and static friction forces were calculated by using different models and compared with the experimentally measured force. The effect of NP morphology on the nanoscale friction is discussed.

In the present work, we demonstrate a novel approach to nanotribological measurements based on the bending manipulation of hexagonal ZnO nanowires (NWs) in an adjustable half-suspended configuration inside a scanning electron microscope. A pick-and-place manipulation technique was used to control the length of the adhered part of each suspended NW. Static and kinetic friction were found by a ‘self-sensing’ approach based on the strain profile of the elastically bent NW during manipulation and its Young’s modulus, which was separately measured in a three-point bending test with an atomic force microscope. The calculation of static friction from the most bent state was completely reconsidered and a novel more realistic crack-based model was proposed. It was demonstrated that, in contrast to assumptions made in previously published models, interfacial stresses in statically bent NW are highly localized and interfacial strength is comparable to the bending strength of NW measured in respective bending tests.

Adhesion forces between functionalized gold colloidal nanoparticles (Au NPs) and scanning probe microscope silicon tips were experimentally investigated by atomic force microscopy (AFM) equipped with PeakForce QNM (Quantitative Nanoscale Mechanics) module. Au NPs were synthesized by a seed-mediated process and then functionalized with thiols containing different functional groups: amino, hydroxy, methoxy, carboxy, methyl, and thiol. Adhesion measurements showed strong differences between NPs and silicon tip depending on the nature of the tail functional group. The dependence of the adhesion on ligand density for different thiols with identical functional tail-group was also demonstrated. The calculated contribution of the van der Waals (vdW) forces between particles was in good agreement with experimentally measured adhesive values. In addition, the adhesion forces were evaluated between flat Au films functionalized with the same molecular components and silicon tips to exclude the effect of particle shape on the adhesion values. Although adhesion values on flat substrates were higher than on their nanoparticle counterparts, the dependance on functional groups remained the same.

Polydimethylsiloxane (PDMS) is the most widely used silicon-based polymer due to its versatility and its various attractive properties. The fabrication of PDMS involves liquid phase cross-linking to obtain hydrophobic and mechanically flexible material in the final solid form. This allows to add various fillers to affect the properties of the resulting material. PDMS has a relatively low Thermal Conductivity (TC), in the order of 0.2 W/mK, which makes it attractive for thermal insulation applications such as sealing in construction. Although a further decrease in the TC of PDMS can be highly beneficial for such applications, most research on the thermal properties of PDMS composites have focused on fillers that increase the TC rather than decrease it. In the present work, we propose a simple and reliable method for making a PDMS-based composite material with significantly improved thermal insulation properties, by adding hollow glass microspheres (HGMs) to the mixture of the liquid base and the cross-linker (10:1 ratio), followed by degassing and heat-assisted crosslinking. We obtained a 31% reduction of thermal conductivity and a 60% increase in the elastic modulus of samples with HGM content of 17% by weight. At the same time, the sound insulation capacity of the PDMS-HGM composite is slightly decreased in comparison to pure PDMS, as a result of its lower density. Finally, the wettability of the samples had no dependence on HGM content.