Thermoplastic materials such as PA12 and PA6 have been extensively employed in Selective Laser Sintering (SLS) 3D printing applications due to their printability, processability, and crystalline structure. However, thermoplastic-based materials lack polymer inter-chain bonding, resulting in inferior mechanical and thermal properties and relatively low fatigue behavior. Therefore, 3D printing of high-performance crosslinked thermosets using SLS technology is paramount to pursue as an alternative to thermoplastics. In this work, a thermoset resin was successfully 3D printed using SLS, and its thermal stability of printed parts after a multi-step post-curing process was investigated. Dimensionally stable and high glass transition temperature (T_g: ~300 °C) thermoset parts were fabricated using SLS. The polymer crosslinking mechanism during the printing and curing process was investigated through FTIR spectra, while the mechanical stability of the SLS 3D-printed thermoset was characterized through compression tests. It is found that 100% crosslinked thermoset can be 3D printed with 900% higher compressive strength than printed green parts.

Fabrication of parts exhibiting multi-functionality has recently been complemented by hybrid polymer extrusion additive manufacturing in combination with wire embedding technology. While much mechanical characterization has been performed on parts produced with fused deposition modeling, limited characterization has been performed when combined electrical and thermal loads are applied to 3D printed multi-material parts. As such, this paper describes the design, fabrication, and testing of 3D printed thermoplastic coupons containing embedded copper wires that carried current. An automated fabrication process was used employing a hybrid additive manufacturing machine that dispensed polycarbonate thermoplastic and embedded bare copper wires. Testing included AC and DC hipot testing as well as thermal testing on as-fabricated and heat treated coupons to determine the effect of porosity in the substrate. The heat-treated parts contained reduced amounts of porosity, as corroborated through scanning electron microscopy, which led to a 50 % increased breakdown strength and 30 to 40 % increased heat dissipation capabilities. The results of this paper are describing a set of design protocol that can be used as a guideline for 3D printed embedded electronics to predict the electrical and thermal behavior.