Polymer matrix wave transparent composites are used in a variety of high-speed communication applications. One of the applications of these involves making protective enclosures for antennas of microwave towers, air vehicles, weather radars, and underwater communication devices. Material performance, structural, thermal, and mechanical degradation are matters of concern as advanced wireless communication needs robust materials for radomes that can withstand mechanical and thermal stresses. These polymer composite radomes are installed externally on antennas and are exposed directly to ambient as well as severe conditions. In this research, epoxy resin was reinforced with a small amount of quartz fibers to yield an improved composite radome material compared to a pure epoxy composite with better thermal and mechanical properties. FTIR spectra, SEM morphology, dielectric constant (Ɛ_r) and dielectric loss (δ), thermal degradation (weight loss), and mechanical properties were determined. Compared to pure epoxy, the lowest values of Ɛ_r and δ were 3.26 and 0.021 with 30 wt.% quartz fibers in the composite, while 40% less weight loss was observed which shows its better thermal stability. The mechanical characteristics encompassing tensile and bending strength were improved by 42.8% and 48.3%. In high-speed communication applications, compared to a pure epoxy composite, adding only a small quantity of quartz fiber can improve the composite material’s dielectric performance, durability, and thermal and mechanical strength.

For curing of fiber-reinforced epoxy composites, an alternative to thermal heating is the use of microwave energy, which cures quickly and consumes less energy. Employing thermal curing (TC) and microwave (MC) curing methods, we present a comparative study on the functional characteristics of fiber-reinforced composite for microelectronics. The composite prepregs, prepared from commercial silica fiber fabric/epoxy resin, were separately cured via thermal and microwave energy under curing conditions (temperature/time). The dielectric, structural, morphological, thermal, and mechanical properties of composite materials were investigated. Microwave cured composite showed a 1% lower dielectric constant, 21.5% lower dielectric loss factor, and 2.6% lower weight loss, than thermally cured one. Furthermore, the dynamic mechanical analysis (DMA) revealed a 20% increase in the storage and loss modulus along with a 15.5% increase in the glass transition temperature (Tg) of microwave-cured compared to thermally cured composite. The fourier transformation infrared spectroscopy (FTIR) showed similar spectra of both the composites; however, the microwave-cured composite exhibited higher tensile (15.4%), and compression strength (4.3%) than the thermally cured composite. These results illustrate that microwave-cured silica-fiber-reinforced composite exhibit superior electrical performance, thermal stability, and mechanical properties compared to thermally cured silica fiber/epoxy composite in a shorter time and the expense of less energy.

In many electronic applications, the dielectric and structural properties of reinforced composites are vital. In this research work, the influence of fiber proportion on the properties of a silica fiber/epoxy (SFE) composite was investigated. The structure, morphology, dielectric constant and loss factor, mechanical properties, and thermal stability were determined. The increase of wt.% of silica fiber (SiO_{2 (f)}) x = 30 to 90, reduced the dielectric constant (εr) and dielectric loss (δ) of the SFE composite from their original values to 18.9% and 48.5%, lowering local charge displacement towards the applied electric field. The SFE composite showed higher mechanical properties with the increase in SiO_{2 (f)}, x = 30 to 80, the tensile strength (UTS) was raised from 91.6 MPa to 155.7 MPa, the compression strength (UCS) was increased from 261.1 MPa to 409.6 MPa and the flexural strength was enhanced from 192.3 MPa to 311.9 MPa. Upon further addition of SiO_{2 (f)} to the composite, i.e., x = 90, the mechanical properties were reduced a little, but the dielectric properties were not changed. Increasing SiO_{2 (f)} improved the thermal stability as weight loss was found to be 69% (x = 30) and 24% (x = 90), and average moisture absorption was found to be 1.1 to 1.8%. A silica fiber/epoxy composite, for microelectronics, can be made from a low-cost fiber, and its dielectric properties as well as its mechanical and thermal stability can be tuned or improved by varying fiber fractions.

Approaches to retain or improve wave-transparent composite properties received ongoing attention. Silica glass fiber composites are being utilized in wave transparency applications owing to their excellent dielectric properties. During operational service life, they are exposed to ambient and harsh environments, which degrade their performance and properties. The objective is to evaluate the progressive degradation of silica fiber wave-transparent composite material’s properties and overall performance. Silica fiber/epoxy wave-transparent composites (SFWCs) were fabricated by stacking high-silica glass cloth (HSG) plies via multi-layer compression and curing at 150 °C (14 hrs) and were investigated upon one-year real-time weathering and 20-year accelerated aging (Hallberg peck model). The morphology of one-year-aged SFWC composite was found to be better than that of 20-year-aged SFWC, where relatively weakened interfacial bonding and composite structure were observed. One year weathering the dielectric constant (ε_r) was increased to 4.34%, and dielectric loss (δ) was found to be 5.6%, whereas upon accelerated conditions (equivalent to 20 yrs of ambient conditions), ε_r was significantly raised 30.63% from its original value (3.2), and δ was increased 22.8% (0.035). In the 20-year aged SFWC composite, the maximum absorbed moisture was 3.1%. Tensile strength dropped from 147.8 MPa to 136.48 MPa, and compressive strength from 388.54 MPa to 374.41 MPa. Upon aging (from 1 year of weathering to 20 years of accelerated aging), SFWC composite properties and functional performance were lowered but remained reasonable. SFWC properties, as revealed by microscale characterization, can contribute to the determination of the impact of deterioration and useful service life in respective microelectronics wave transparency applications.