The main goal of this work is to open new perspectives in the field of electrodeposition and provide green alternatives to the electroplating industry. The effect of different anions (SO₄^2-, ClO₃^-, NO₃^-, ClO₄^-, BF₄^-, PF₆^-) in solution on the electrodeposition of copper was investigated. The solutions, containing only the copper precursor and the background electrolyte, were tailored to minimize the environmental impact and reduce the use of organic additives and surfactants. The study is based on electrochemical measurements carried out to verify that no metal complexation takes place. We assessed the nucleation and growth mechanism, we performed a morphological characterization through scanning electron microscopy and deposition efficiency by measuring the film thickness through X-ray fluorescence spectroscopy. Significant differences in the growth mechanism and in the morphology of the electrodeposited films, were observed as a function of the background electrolyte.

Apical interaction of O₂ with a square planar macrocyclic Pd(ii) complex anchored on MWCNTs gives rise to a significant electrocatalytic activity towards the oxygen reduction reaction (ORR). This finding confirms previous computational data.

Electroplating is a key process in many industrial fields such as automotive, electronics and decorative applications; this process makes it possible to provide new properties to substrates materials such as corrosion resistance, hardness and aesthetic value. Nonetheless, electroplating is considered one of the most non-sustainable industries related to the manufacturing sector, from both an environmental and a social point of view. With the approaching deadlines set by the United Nations for the 2030 Agenda, electroplating companies have started a trend of innovating their production processes with a focus on sustainability, acting on several fronts: performing simulations to predict criticalities and optimize working procedures, reducing the material used and recovering it from processing water. The purpose of this communication is to highlight the state of the art of sustainable practices peculiar to the electroplating industry, critically analyzing ongoing challenges to achieve and exceed the targets set by regulatory agencies. Both atomistic and multiphysics simulations will be analyzed as powerful tools to design both new sustainable formulations and items; then, the problem of metal dispersion will be discussed, evaluating different industrial approaches; finally, the focus will be shifted towards the general procedures to recover metal from wastewater.

A method for the determination of the intermetallic diffusion coefficient in the Cu-Au system is described based on energy dispersive X-ray techniques. XRF and EDS analysis were used to measure the thickness of the electroplated gold coating and the copper diffused through it, respectively. This information was used to obtain the diffusion coefficient through an equation based on Fick's law. Colour measurements and metallographic section analysis of the samples were also performed to evaluate alternative methods for a qualitative determination of diffusion rate. The thickness of the gold layer was chosen in agreement with what is used in decorative and functional applications (<1 μm). The measurements were performed on samples heated in a range of temperatures between 100 °C and 200 °C from 12 to 96 h. The results obtained follow a linear trend between the logarithm of the diffusion coefficient and the inverse of the temperature and are in line with the values found in the literature.