We report on the wettability properties of silicon surfaces, simultaneously structured on the micrometre-scale and the nanometre-scale by femtosecond (fs) laser irradiation to render silicon hydrophobic. By varying the laser fluence, it was possible to control the wetting properties of a silicon surface through a systematic and reproducible variation of the surface roughness. In particular, the silicon–water contact angle could be increased from 66° to more than 130°. Such behaviour is described by incomplete liquid penetration within the silicon features, still leaving partially trapped air inside. We also show how controllable design and tailoring of the surface microstructures by wettability gradients can drive the motion of the drop’s centre of mass towards a desired direction (even upwards).
11 November 2013 in Journal of Materials Chemistry A
Al-substituted Li7La3Zr2O12 (LLZO) pellets with a grain size of 100–200 μm and a relative density of 94% were prepared by conventional solid-state processing at a sintering temperature of 1100 °C, 130 °C lower than previously reported. Morphological features and the presence of impurities were evaluated by X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). Femtosecond Laser Induced Breakdown Spectroscopy (LIBS) was used to visualize the distribution of impurities. The results suggest that chemical composition of the powder cover strongly affects morphology and impurity formation, and that particle size control is critical to densification. These properties, in turn, strongly affect total ionic conductivity and interfacial resistance of the sintered pellets.
Gigahertz (GHz) femtosecond (fs) lasers have opened possibilities for enhancing and controlling the laser machining quality to engineer the physicochemical properties of materials. However, fundamental understanding of laser-material interactions by GHz fs laser has remained unsolved due to the complexity of associated ablation dynamics. Here, we study the ablation dynamics of copper (Cu) by GHz fs bursts using in situ multimodal diagnostics, time-resolved scattering imaging, emission imaging, and emission spectroscopy. A combination of probing techniques reveals that GHz fs bursts rapidly remove molten Cu from the irradiated spot due to the recoil pressure exerted by following fs pulses. Material ejection essentially stops right after the burst irradiation due to the limited amount of remnant matter, combined with the suppressed heat conduction into the target material. Our work provides insights into the complex ablation mechanisms incurred by GHz fs bursts, which are critical in selecting optimal laser conditions in cross-cutting processing, micro/nano-fabrication, and spectroscopy applications.