A scalable, binder-free and one-step electric discharge rusting technique is proposed to fabricate high performance Fe–Fe _{1− x} O based coplanar microsupercapacitors.

As the thickness of an ultra-thin flattened heat pipe (UTHP) decreases, the fabrication difficulty increases exponentially, and the thermal performance deteriorates rapidly. In this study, three types of composite wicks were developed for UTHPs with a 0.6 mm thickness: copper foam and mesh wick (CFMW), two layers of different mesh wick (TDMW), and three layers of the same mesh wick (TSMW). The startup and steady-state performances of the UTHPs with liquid filling ratios of 60% to 120% were investigated. The findings indicated that the CFMW UTHP with a filling ratio of 100% exhibited the best startup performance, with the highest equilibrium temperature of 58.37 °C. The maximum heat transport capacities of the CFMW, TDMW, and TSMW UTHP samples were 9, 8, and 8.5 W, respectively, at their corresponding optimum filling ratios of 110%, 90%, and 100%. The CFMW UTHP exhibited the lowest evaporation and condensation thermal resistances of 0.151 and 0.189 K/W, respectively, which were 24.67% and 41.85% lower than those of the TSMW UTHP. CFMW can be used to improve the thermal performance of UTHPs. This study provides important guidelines for the structural design, fabrication technology, and performance improvement of high-performance UTHPs used in portable electronic devices.

Vanadium oxide-based electrode materials have attracted increasing attention owing to their extraordinary capacitance and prolonged lifespan, excellent conductivity and outstanding electrochemical reversibility. However, the development of vanadium oxide-based integrated electrodes with outstanding capacitive performance is an enduring challenge. This research reports a facile method for structuring 3D Archimedean micro-supercapacitors (AMSCs) composed of Mo doped V–VO_0.2 (Mo@V–VO_0.2) based integrated electrodes with designable geometric shape, using computer-aided wire electric discharge machining (WEDM). The performance of Mo@V–VO_0.2 based AMSCs manufactured by different processing voltages of 60 V, 80 V and 100 V were evaluated. It was found that 80 V is the optimal processing voltage for manufacturing Mo@V–VO_0.2 based AMSCs with the best electrochemical performance. This device demonstrates superior capacitive behavior even at an ultra-high scan rate of 50, 000 mV s⁻¹, and achieves a good capacitance retention rate of 94.4% after 2000 cycles. Additionally, the characteristics of electric field distribution were also simulated for optimizing the geometric structure of the microdevices. This WEDM fabrication technique, which is easy, secure, patternable, efficient, economical, eco-friendly, and does not require binders or conductive additives, enables the development of high-capacity 3D pseudocapacitive micro-supercapacitors and demonstrates the great potential for metal oxide synthesis and microdevice manufacturing.

Transition metal oxides, distinguished by their high theoretical specific capacitance values, inexpensive cost, and low toxicity, have been extensively utilized as electrode materials for high-performance supercapacitors. Nevertheless, their conductivity is generally insufficient to facilitate rapid electron transport at high rates. Therefore, research on bimetallic oxide electrode materials has become a hot spot, especially in the field of micro-supercapacitors (MSC). Hence, this study presents the preparation of bimetallic oxide electrode materials via electro-spark machining (EM), which is efficient, convenient, green and non-polluting, as well as customizable. The fabricated copper-molybdenum bimetallic oxide (MoCuO_x) device showed good electrochemical performance under the electrode system. It provided a high areal capacity of 50.2 mF cm⁻² (scan rate: 2 mV s⁻¹) with outstanding cycling retention of 94.9% even after 2000 cycles. This work opens a new window for fabricating bimetallic oxide materials in an efficient, environmental and customizable way for various electronics applications.