Ming Wen

Prof. Dr. Ming Wen

orcid

Research Focus & Metrics

Academic Career Length

13Years (2014-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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30 June 2018 in Journal of Materials Science: Materials in Electronics
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Journal Article
Closed access
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YDYahong Du
Yahong Du
ZLZhi-Quan Liu
Zhi-Quan Liu
HJHongjun Ji
Hongjun Ji
MLMingyu Li
Mingyu Li
MWMing Wen
Ming Wen

14 August 2025 in ACS Catalysis
Verified
Journal Article
Closed access
ZLZhiwen Li
Zhiwen Li
XZXiangji Zhou
Xiangji Zhou
YLYongqi Liu
Yongqi Liu
XLXimin Li
Ximin Li
YSYue Shen
Yue Shen
LQLihua Qian
Lihua Qian

6 February 2023 in Vacuum
Verified
Journal Article
Closed access
ZNZheda Ning
Zheda Ning
YWYiqing Wang
Yiqing Wang
SLSixie Li
Sixie Li
KTKe Tang
Ke Tang
MWMing Wen
Ming Wen

24 May 2023 in Materials
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Journal Article
Open access
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TCTiantian Chen
Tiantian Chen
MWMing Wen
Ming Wen
HCHao Cui
Hao Cui
JGJunmei Guo
Junmei Guo
CWChuanjun Wang
Chuanjun Wang
In this study, pure copper’s hot deformation behavior was studied through isothermal compression tests at deformation temperatures of 350~750 °C with strain rates of 0.01~5 s−1 on a Gleeble-3500 isothermal simulator. Metallographic observation and microhardness measurement were carried out of the hot compressed specimens. By analyzing the true stress–strain curves of pure copper under various deformation conditions during the hot deformation process, the constitutive equation was established based on the strain-compensated Arrhenius model. On the basis of the dynamic material model proposed by Prasad, the hot-processing maps were acquired under different strains. Meanwhile, the effect of deformation temperature and strain rate on the microstructure characteristics was studied by observing the hot-compressed microstructure. The results demonstrate that the flow stress of pure copper has positive strain rate sensitivity and negative temperature correlation. The average hardness value of pure copper has no obvious change trend with the strain rate. The flow stress can be predicted with excellent accuracy via the Arrhenius model based on strain compensation. The suitable deforming process parameters for pure copper were determined to be at a deformation temperature range of 700~750 °C and strain rate range of 0.1~1 s−1.

31 March 2022 in Materials
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Journal Article
Open access
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TWTingting Wang
Tingting Wang
BXBingguo Xue
Bingguo Xue
HCHao Cui
Hao Cui
YZYingying Zhang
Yingying Zhang
MLManmen Liu
Manmen Liu
Shaohong LiuShaohong Liu
Shaohong Liu
LuAG:Ce (Lu3Al5O12:Ce) is one of the most important color converters in white lighting industry. Especially, LuAG:Ce film attracts more attention due to the outstanding advantages, such as the efficient heat dissipation, the saving of rare earth, and so on. Here, LuAG:Ce film on sapphire was successfully prepared by the ultrasonic spray pyrolysis process. The phase, microstructure and photoluminescence of LuAG:Ce films were investigated. LuAG:Ce films had a thickness of around 5 μm, which were well crystallized at 1000 °C in air atmosphere to form the typical garnet structure. Under the protection of CO atmosphere, increasing the annealing temperature greatly enhanced the photoluminescence performance. After annealing at 1500 °C for 5 h in CO atmosphere, 3.0 mol.% Ce3+ doped LuAG:Ce film exhibited the highest emission and excitation intensity. The emission intensity of 3.0 mol.% Ce3+ doped LuAG:Ce film annealed at 1500 °C in CO atmosphere increased up to five times, when compared with the best LuAG:Ce film annealed at 1000 °C in air atmosphere. The effects of Ce3+ doping concentration on the photoluminescence were also examined. As the Ce3+ doping concentration increased from 0.2 mol.% to 7.0 mol.%, the color of LuAG:Ce films changed from yellowish green to greenish yellow. When coupling the 3.0 mol.% Ce3+ doped LuAG:Ce film with a 0.5 W 450 nm blue laser, the formed device successfully emitted white light.