In laser processing, due to the short interaction time between an ultrashort pulse laser and silicon, it has been difficult to study the lattice temperature change characteristics of silicon. In this paper, the interaction between a picosecond laser and silicon was studied. Based on the Fokker–Planck equation and two-temperature model (TTM) equation, a simulation model of silicon heating by different pulse-width picosecond lasers was established. The results show that within the range of 15 to 5 ps, the maximum lattice temperature tended to increase first and then decrease with the decreasing pulse width. The watershed was around 7.5 ps. The model error was less than 3.2% when the pulse width was 15 ps and the single pulse energy was 25 μJ.

Soda–lime glass has a wide range of applications in the fields of smart electronics, optical components, and precision originals. In order to investigate the effect of processing parameters on picosecond Bessel laser cutting of soda–lime glass and to achieve high-quality soda–lime glass cutting, a series of cutting experiments were conducted in this study. In this study, it was found that the machining point spacing, the incident laser energy, and the number of burst modes had a significant effect on the machining of the samples. The atomic force microscope (AFM) showed a better quality of roughness of the machined cross-section when the spacing of the machining points was 1 μm, a locally optimal solution was obtained when the number of burst modes was 2, and a locally optimal solution was also obtained when the incident laser power was 11.5 W. In this study, better machining quality was achieved for soda–lime glass of 1 mm thickness, with an average roughness of 158 nm and a local optimum of 141 nm.