Bin Xie

Dr. Bin Xie

School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

Research Focus & Metrics

Academic Career Length

11Years (2016-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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22 May 2023 in Materials Science and Engineering: R: Reports
Verified
Journal Article
Closed access
Bin XieBin Xie
Bin Xie
WZWeixian Zhao
Weixian Zhao
XLXiaobing Luo
Xiaobing Luo
RHRun Hu
Run Hu

27 June 2025 in Science Advances
Verified
Journal Article
Open access
GYGanguang Yang
Ganguang Yang
YQYuqi Qiu
Yuqi Qiu
BPBo Pang
Bo Pang
WGWei Guo
Wei Guo
SLShaoyu Liu
Shaoyu Liu
Hao WuHao Wu
Hao Wu
Achieving accurate locating of perforating arteries (PAs) has great clinical value in various biomedical applications, such as free flap transfer. However, the anatomical variability of these arteries presents a major challenge in PA locating, and existing methods have various disadvantages, limiting their applications. Here, we propose a reusable and flexible hydrogel biosensor array for noninvasive, precise, and efficient PA locating. Particularly, we develop electrically responsive hydrogels to establish rapidly detachable device/hydrogel interfaces, endowing the reusability of the biosensor array. Meanwhile, the adhesion of hydrogel/skin interfaces is also enhanced to facilitate high-fidelity signal acquisition. By analyzing the photoplethysmography (PPG) infrared (IR) signals, the biosensor array can accurately and responsively locate PAs across different types of free flaps in clinical cases, outperforming existing techniques. This biosensor array represents a promising platform for PA locating. The strategy of hydrogel interface design paves the way for the development of reusable flexible electronics in biomedical applications to avoid cross-infection and reduce device costs.

1 January 2024 in Opto-Electronic Advances
Verified
Journal Article
Closed access
PDF file
XYXuan Yang
Xuan Yang
XZXinfeng Zhang
Xinfeng Zhang
TZTianxu Zhang
Tianxu Zhang
LXLinyi Xiang
Linyi Xiang
Bin XieBin Xie
Bin Xie
XLXiaobing Luo
Xiaobing Luo
Thermal management of nanoscale quantum dots (QDs) in light-emitting devices is a long-lasting challenge. The existing heat transfer reinforcement solutions for QDs-polymer composite mainly rely on thermal-conductive fillers. However, this strategy failed to deliver the QDs’ heat generation across a long distance, and the accumulated heat still causes considerable temperature rise of QDs-polymer composite, which eventually menaces the performance and reliability of light-emitting devices. Inspired by the radially aligned fruit fibers in oranges, we proposed to eliminate this heat dissipation challenge by establishing long-range ordered heat transfer pathways within the QDs-polymer composite. Ultrahigh molecular weight polyethylene fibers (UPEF) were radially aligned throughout the polymer matrix, thus facilitating massive efficient heat dissipation of the QDs. Under a UPEF filling fraction of 24.46 vol%, the in-plane thermal conductivity of QDs-radially aligned UPEF composite (QDs-RAPE) could reach 10.45 W m−1 K−1, which is the highest value of QDs-polymer composite reported so far. As a proof of concept, the QDs’ working temperature can be reduced by 342.5 °C when illuminated by a highly concentrated laser diode (LD) under driving current of 1000 mA, thus improving their optical performance. This work may pave a new way for next generation high-power QDs lighting applications.

30 August 2022 in Nanotechnology
Verified
Journal Article
Closed access
XYXuan Yang
Xuan Yang
SZShuling Zhou
Shuling Zhou
XZXinfeng Zhang
Xinfeng Zhang
LXLinyi Xiang
Linyi Xiang
Bin XieBin Xie
Bin Xie
XLXiaobing Luo
Xiaobing Luo
Quantum dots (QDs) are facing significant photoluminescence degradation in moisture environment. In QDs-silicone composites, the poor water resistance of silicone matrix makes it easy for water and oxygen molecules to erode QDs. To tackle this issue, we proposed a new QDs protection strategy by introducing short-chain silica precursors onto the QDs’ surface, so that a dense silica passivation layer could be formed onto the QDs nanoparticles. Sol-gel method based on 3-aminopropyl triethoxysilane (APTES), 3-mercaptopropyl trimethoxysilane (MPTMS), and 3-mercaptopropyl triethoxysilane (MPTES) were adopted to prepare the uniform and crack-free QDs-silica glass (QD-glass). Because of the crosslinking of short-chain precursors, the formed silica glass possesses 38.6% smaller pore width and 68.6% lower pore volume than silicone, indicating its denser cross-linked network surrounding QDs. After 360 h water immersion, the QDs-glass demonstrated a 6% enhancement in red-light peak intensity, and maintained a stable full width at half maximum (FWHM) and peak wavelength, proving its excellent water-resistant ability. However, the conventional QDs-silicone composites not only showed a decrease of 75.3% in red-light peak intensity, but also a broadened FWHM and a redshifted peak wavelength after water immersion. QDs-glass also showed superior photostability after 132 h exposure to blue light. Red-light peak intensity of QDs-glass remained 87.3% of the initial while that of QDs-silicone decreased to 19.8%. And the intensity of QDs-glass dropped to 62.3% of that under 20 °C after thermal treatment of 160 °C. Besides, under increasing driving currents, the light conversion efficiency drop of QDs-glass is only one fifth that of QDs-silicone. Based on the QDs-glass, the white light-emitting diodes was achieved with a high luminous efficiency of 126.5 lm W −1 and a high color rendering index of 95.4. Thus, the newly proposed QD-glass has great significance in guaranteeing the working reliability of QDs-converted devices against moisture and high-power environment.

30 July 2022 in Micromachines
Verified
Journal Article
Open access
PDF file
PXPuzhen Xia
Puzhen Xia
Bin XieBin Xie
Bin Xie
XLXiaobing Luo
Xiaobing Luo
The photoluminescent composite, which consists of micro-/nanoscale photoluminescent particles and a polymer matrix, plays a key role in optical wavelength conversion in white-light-emitting diodes (WLEDs). Heat is inevitably generated within the composite due to the energy lost through conversion and cannot be easily dissipated due to the extremely low thermal conductivity of the polymer matrix. Consequently, the composite suffers from a high working temperature, which severely deteriorates its optical performance as well as its long-term stability in WLEDs. To tackle this thermal issue, in this work three-dimensional (3D)-interconnected thermal conducting pathways composed of hexagonal boron nitride (hBN) platelets were constructed inside a photoluminescent composite, using a simplified bubbles-templating method. The thermal conductivity of the composite was efficiently enhanced from 0.158 to 0.318 W/(m∙K) under an ultralow hBN loading condition of 2.67 wt%. As a result, the working temperature of the photoluminescent composite in WLEDs was significantly reduced by 32.9 °C (from 102.3 °C to 69.4 °C, under 500 mA). Therefore, the proposed strategy can improve the heat accumulation issue in photoluminescent composites and thus improve the optical stability of WLEDs.

10 April 2019 in Journal of Electronic Packaging
Verified
Journal Article
Closed access
PDF file
Bin XieBin Xie
Bin Xie
HLHaochen Liu
Haochen Liu
Xiao Wei SunXiao Wei Sun
Xiao Wei Sun
XYXingjian Yu
Xingjian Yu
RWRuikang Wu
Ruikang Wu
XLXiaobing Luo
Xiaobing Luo
White light-emitting diodes (WLEDs) composed of blue LED chip, yellow phosphor, and red quantum dots (QDs) are considered as a potential alternative for next-generation artificial light source with their high luminous efficiency (LE) and color-rendering index (CRI) while QDs' poor temperature stability and the incompatibility of QDs/silicone severely hinder the wide utilization of QDs-WLEDs. To relieve this, here we proposed a separated QDs@silica nanoparticles (QSNs)/phosphor structure, which composed of a QSNs-on-chip layer with a yellow phosphor layer above. A silica shell was coated onto the QDs surface to solve the compatibility problem between QDs and silicone. With CRI > 92 and R9 > 90, the newly proposed QSNs-based WLEDs present 16.7% higher LE and lower QDs working temperature over conventional mixed type WLEDs. The reduction of QDs' temperature can reach 11.5 °C, 21.3 °C, and 30.3 °C at driving current of 80 mA, 200 mA, and 300 mA, respectively.