With the development of miniaturization and integration of electronic devices, the conventional manifold microchannels (MMCs) structure has been unable to meet the heat dissipation requirements caused by the rapid growth of internal heat flux. There is an urgent need to design a new heat dissipation structure with higher heat dissipation capacity to ensure the working stability and life of electronic devices. In this paper, we designed a novel manifold dual-microchannel (MDMC) cooling system that embedded the microchannel structure into the manifold microchannel structure. The MDMC not only has good heat dissipation performance that can meet the development needs of electronic equipment to miniaturization and integration, but also has a compact structure that does not increase the overall thickness and volume compared with MMC. The high temperature uniformity and heat transfer performance of MDMC are significantly improved compared to MMC. The T_max is reduced by 13.6% and 17.5% at the heat flux density of 300 W/cm² and 700 W/cm², respectively. In addition, the influence of the inlet−2 velocity and the total microchannels number on the heat transfer performance of the MDMC structure are numerically investigated. The results show that the decrease rate of T_max and ΔT is about 6.69% and 16% with the increase of inlet−2 velocity from 1.2 m/s to 2.4 m/s and microchannels number from 10 to 48, respectively. At the same time, the best temperature uniformity is obtained when the number of microchannels is 16.

With the constant increase in communication requirements in modern society, the number and type of antennas on communication platforms have been increasing at an accelerating rate. This has led to a continuous increase in platform volume and weight, and the electromagnetic environment of antenna operating has increasingly worsened, seriously restricting the further development of communication systems. As a new communication system antenna type, a reconfigurable microstrip antenna can reconstruct operating frequencies, beam directions, etc., by changing the antenna structure to provide the good multifunction characteristics of a single antenna, avoiding the electromagnetic compatibility issues caused by numerous system antennas. At present, most of the research on reconfigurable antennas judges the influence of structural characteristics on electromagnetic characteristics by simulation, which has imposed restrictions on their development and application. Therefore, a reconfigurable antenna with a resonant frequency of 8.66 GHz and 15.26 GHz and a reconfigurable antenna with maximum radiation directions of 36.2° and −36.5° are designed in this paper, and the electromechanical coupling theory of the reconfigurable antennas is studied. The resonance frequency coupling model and the pattern function coupling model considering the structural deformation of a reconfigurable microstrip antenna are established. Within the applicable range of antenna structural parameters, the relative error between the resonance frequency coupling model and the pattern function coupling model is less than 5%, which meets practical engineering application requirements. Finally, the method is shown by experimentation to verify the accuracy and validity of the proposed electromechanical coupling model.