Energy harvesting (EH) technique has been proposed as a favorable solution for addressing the power supply exhaustion in a wireless sensor node and prolong the operating time for a wireless sensor network. Thermoelectric energy generator (TEG) is a valuable device converting the waste heat into electricity which can be collected and stored for electronics. In this paper, the thermal energy from human body is captured and converted to the low electrical energy by means of thermoelectric energy harvester. The aim of presented work is utilizing the converted electricity to power the related electronic device and to extend the working life of a sensor node. Considering the related characteristics of TEG used for human, a type of a novel power management system is designed and presented to harvest generated electricity. The proposed circuit is developed based on off-the-shelf commercial chips, LTC3108 and BQ25504. It can accept the lowest input voltage of 20 mV, which is more suitable for human thermoelectric energy harvesting. Through experiments, developed energy harvesting system can effectively power the sensor to intermittently transmit the data as well as perform the converted energy storage. Compared to the independent commercial chips applications and other microcontroller-based energy harvesting systems, the designed thermoelectric energy harvester system presents the advantages not only in high energy storage utilization rate but also the ultra-low input voltage characteristic. Since the heat from human body is harvested, therefore, the system can possibly be used to power the sensor placed on human body and has practical applications such as physiological parameter monitoring.

Atomistic simulations are capable of providing insights into physical mechanisms responsible for mechanical properties of the transition metal of Tantalum (Ta). By using molecular dynamics (MD) method, temperature and pressure dependences of the elastic properties of Ta single crystals are investigated through tensile loading. First of all, a comparative study between two types of embedded-atom method (EAM) potentials is made in term of the elastic properties of Ta single crystals. The results show that Ravelo-EAM (Physical Review B, 2013, 88: 134101) potential behaves well at different hydrostatic pressures. Then, the MD simulation results based on the Ravelo-EAM potential show that Ta will experience a body-centered-cubic (BCC) to face-centered-cubic (FCC) phase transition before fracture under tensile loading at 1 K temperature, and model size and strain rate have no obvious effects on tensile behaviors of Ta. Next, from the simulation results at the system temperature from 1 to 1500 K, it can be derived that the elastic modulus of E100 linearly decrease with the increasing temperature, while the yielding stress decrease with conforming a quadratic polynomial formula. Finally, the pressure dependence of the elastic properties is performed from 0 to 140 GPa and the observations show that the elastic modulus increases with the increasing pressure overall.

Surface mount technology (SMT) plays an important role in integrated circuits, but due to thermal stress alternation caused by temperature cycling, it tends to have thermo-mechanical reliability problems. At the same time, considering the environmental and health problems of lead (Pb)-based solders, the electronics industry has turned to lead-free solders, such as ternary alloy Sn-3Ag-0.5Cu (SAC305). As lead-free solders exhibit visco-plastic mechanical properties significantly affected by temperature, their thermo-mechanical reliability has received considerable attention. In this study, the interface delamination of an SMT solder joint using a SAC305 alloy under temperature cycling has been analyzed by the nonlinear finite element method. The results indicate that the highest contact pressure at the four corners of the termination/solder horizontal interface means that delamination is most likely to occur, followed by the y-direction side region of the solder/land interface and the top arc region of the termination/solder vertical interface. It should be noted that in order to keep the shape of the solder joint in the finite element model consistent with the actual situation after the reflow process, a minimum energy-based morphology evolution method has been incorporated into the established finite element model. Eventually, an Improved Efficient Global Optimization (IEGO) method was used to optimize the geometry of the SMT solder joint in order to reduce the contact pressure at critical points and critical regions. The optimization result shows that the contact pressure at the critical points and at the critical regions decreases significantly, which also means that the probability of thermal-induced delamination decreases.

With the development of miniaturization and integration of electronic devices, the conventional manifold microchannels (MMCs) structure has been unable to meet the heat dissipation requirements caused by the rapid growth of internal heat flux. There is an urgent need to design a new heat dissipation structure with higher heat dissipation capacity to ensure the working stability and life of electronic devices. In this paper, we designed a novel manifold dual-microchannel (MDMC) cooling system that embedded the microchannel structure into the manifold microchannel structure. The MDMC not only has good heat dissipation performance that can meet the development needs of electronic equipment to miniaturization and integration, but also has a compact structure that does not increase the overall thickness and volume compared with MMC. The high temperature uniformity and heat transfer performance of MDMC are significantly improved compared to MMC. The T_max is reduced by 13.6% and 17.5% at the heat flux density of 300 W/cm² and 700 W/cm², respectively. In addition, the influence of the inlet−2 velocity and the total microchannels number on the heat transfer performance of the MDMC structure are numerically investigated. The results show that the decrease rate of T_max and ΔT is about 6.69% and 16% with the increase of inlet−2 velocity from 1.2 m/s to 2.4 m/s and microchannels number from 10 to 48, respectively. At the same time, the best temperature uniformity is obtained when the number of microchannels is 16.