Nickel base superalloys are widely used to manufacture turbine blades, and overheating poses a serious threat to the safe service of turbine blades. In this study, a second-generation nickel base single crystal superalloy was taken as the research object, and we carried out the overheating treatment at 1100 °C and 1300 °C, and then tested the creep properties at 1000 °C/300 MPa and 1100 °C/130 MPa. Through systematic analysis of creep properties, γ/γ’ phases, and creep voids, the effects of overheating on the microstructures and creep properties of the experimental superalloy were revealed. The results demonstrate that the effect of overheating at 1100 °C on the microstructure of the experimental superalloy can be ignored, and the effect on the creep property is limited. The degree of γ’ dissolution is gradually increased and the creep property is reduced with overheating time extending at the overheating temperature of 1300 °C.

In deep space exploration the exploration equipment will inevitably experience the harsh environment of cryogenic temperature. Solder joints belong to the most vulnerable parts of electronic equipment, and the harsh environment of extreme cryogenic temperature will seriously threaten the reliability of solder joints. In this paper, Sn3.0Ag0.5Cu/Cu solder joints were prepared and stored at cryogenic temperatures (−50 °C, −100 °C, and −196 °C) for up to 960 h, whilst studying the microstructural evolution and deterioration of shear properties. The results showed that the influence of cryogenic temperature on microstructure deterioration was greater than that of storage time. With the decrease of storage temperature and the extension of storage time, the Ag₃Sn intermetallic compounds (IMCs) were uniformly dispersed in the β-Sn matrix; the size decreased and the number increased. After being stored at −196 °C for 960 h, some microcracks appeared at the interface of the solder joints. Meanwhile, the shear force of the solder joints was reduced by 19.02%, and the fracture mode changed from ductile fracture to ductile–brittle mixed fracture. Therefore, it is of great scientific significance to reveal the microstructural evolution and deterioration of shear properties of the solder joints under long-term storage at cryogenic temperatures.

Three kinds of surface ionic contamination tests for printed circuit board (PCB) and printed circuit board assembly (PCBA) products were used in this study, including Ionic Cleanliness Testing (ICT), Resistance of Solvent Extraction (ROSE) and Ion Chromatography (IC). The results showed that the measured values of ionic contamination had increased with the increase of extraction time using the same test method and extraction temperature. In addition, the ionic contamination values detected by ICT and ROSE methods were higher than that of the IC tests. Therefore, the level of surface ionic contamination can be effectively detected in different processes by the above-mentioned three methods, which may guide the optimization of electronic processes and the selection of materials.