Nickel base superalloys are widely used to manufacture turbine blades, and overheating poses a serious threat to the safe service of turbine blades. In this study, a second-generation nickel base single crystal superalloy was taken as the research object, and we carried out the overheating treatment at 1100 °C and 1300 °C, and then tested the creep properties at 1000 °C/300 MPa and 1100 °C/130 MPa. Through systematic analysis of creep properties, γ/γ’ phases, and creep voids, the effects of overheating on the microstructures and creep properties of the experimental superalloy were revealed. The results demonstrate that the effect of overheating at 1100 °C on the microstructure of the experimental superalloy can be ignored, and the effect on the creep property is limited. The degree of γ’ dissolution is gradually increased and the creep property is reduced with overheating time extending at the overheating temperature of 1300 °C.

During the thermal aging process of epoxy resin, microcracks, interfacial delamination, and warpage are the key factors leading to semiconductor device damage. Here, epoxy-resin specimens (EP-Ss) and epoxy-resin/silicon-wafer composites (EP-SWs) were prepared to analyze the distribution of residual stress (RS) in epoxy resin and its thermal aging process changes. The uniaxial tensile approach and Raman spectroscopy (RAS) showed that the peak shift of aliphatic C-O in EP-Ss was negatively correlated with the external stress, and that the stress correlation coefficient was −2.76 × 10⁻² cm⁻¹/MPa. Then, RAS was used to evaluate the RS distribution of EP-SWs, obtaining a high-resolution stress-distribution image of 50 × 50 pixels and revealing a strong stress concentration at the interface between the epoxy resin and the silicon wafer. Additionally, Fourier transform infrared spectroscopy (FTIR), Differential scanning calorimetry (DSC), Field-emission scanning electron microscopy (FE-SEM), and RAS were used to analyze the chemical composition, molecular structure, interfacial microstructure, and RS of the epoxy resin during the thermal aging process. With the increase in the thermal aging time, the epoxy resin underwent secondary curing, the RS at the interface changed from tensile stress to compressive stress, and cracks were formed. The results illuminate the effect of the thermal aging process on the interface-failure mechanism of composite materials, aiding in the reliability evaluation and safety design of semiconductor devices.

Driven by the rapid development of deep-space exploration, artificial intelligence, and new energy vehicles, the integration density of power devices has been significantly improved, creating an urgent demand for electronic packaging interconnection materials with low thermal resistance, high reliability, and thermomechanical stress resistance. Porous metals have become a major research focus for packaging interconnection materials owing to their high specific surface area; controllable porous structure; and excellent thermal, electrical, and mechanical properties. Among various porous metals, porous metal has attracted extensive attention in the field of electronic packaging interconnection due to its low cost, high thermal conductivity, superior wettability, and good processability. This paper systematically reviews the research progress of porous copper (Cu)-based interconnection materials in electronic packaging, covering the preparation methods, interconnection methods and reliability of porous Cu-based interconnection materials. In addition, the existing challenges in the preparation, interconnection processes, and reliability evaluation are summarized, which provides clear research directions for the structural optimization and engineering application of such materials in the future.