A thermal stress range analysis of tungsten-rhenium thin film thermocouples based on ceramic substrates is presented to analyze the falling off and breakage problems caused by the mismatch of the thermal stresses in thin film thermocouples (TFTCs) and substrate, and nano-indentation experiments are done to measure and calculate the film stress to compare with the simulation results. Optimal design and fabrication of tungsten-rhenium TFTCs based on ceramic substrates is reported. Static high temperature tests are carried out, which show the optimization design can effectively reduce the damage caused by the thermal stress mismatch.

A temperature multipoint sensing system based on three cascade Mach–Zehnder interferometers (MZIs) is introduced. The MZIs with different lengths are fabricated based on waist-enlarged fiber bitapers. The fast Fourier transformation is applied to the overlapping transmission spectrum and the corresponding interference spectra can be obtained via the cascaded frequency spectrum based on the inverse Fourier transformation. By analyzing the drift of interference spectra, the temperature response sensitivities of 0.063 nm/°C, 0.071 nm/°C, and 0.059 nm/°C in different furnaces can be detected from room temperature up to 1000 °C, and the temperature response at different regions can be measured through the sensitivity matrix equation. These results demonstrate feasibility of multipoint measurement, which also support that the temperature sensing system provides new solution to the MZI cascade problem.

A thin-film thermocouples (TFTCs) sensor based on silicon carbide substrate, 95 wt% tungsten–5 wt% rhenium (W-5Re) and 74 wt% tungsten–26 wt% rhenium (W-26Re) thermosensitive part with aluminum oxide protective coating layer was designed and fabricated by radio frequency (RF) magnetron sputtering. It exhibited a high thermoelectric voltage of 35.51 mV when the temperature difference was 1240 °C (the hot junction temperature was 1420 °C), with an average Seebeck coefficient of 28.63 µV/°C, which was 27% larger than the standard C-type thermocouple wires at the same temperature difference. The repeatability error was ±4.1%, the drift rate was 9.6 °C/h for 10 h and the laser response time was 0.36 ms. Compared to the traditional thermocouple, it could provide long-term temperature testing within 1420 °C for the requirement of high-temperature measurement and high response speed.

WRe26-In₂O₃ (WRe26 (tungsten-26% rhenium) and In₂O₃ thermoelectric materials) thin film thermocouples (TFTCs) have been fabricated based on magnetron sputtering technology, which can be used in temperature measurement. Many annealing processes were studied to promote the sensitivity of WRe26-In₂O₃ TFTCs. The optimal annealing process of the thermocouple under this kind of RF magnetron sputtering method was proposed after analyzing the properties of In₂O₃ films and the thermoelectric voltage of TFTCs at different annealing processes. The calibration results showed that the WRe26-In₂O₃ TFTCs achieved a thermoelectric voltage of 123.6 mV at a temperature difference of 612.9 K, with a sensitivity of up to 201.6 µV/K. Also, TFTC kept a stable thermoelectric voltage output at 973 K for 20 min and at 773 K for two hours. In general, the WRe26-In₂O₃ TFTCs developed in this work have great potential for practical applications. In future work, we will focus on the thermoelectric stability of TFTCs at higher temperatures.